ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 10, 2026 EDT
Understanding the Behavior of Liquid Crystal Polymer (LCP) in Direct Laser Assisted Bonding (DLAB) for Wafer-level Packaging of MEMS and Related Microsystems
Understanding the Behavior of Liquid Crystal Polymer (LCP) in Direct Laser Assisted Bonding (DLAB) for Wafer-level Packaging of MEMS and Related Microsystems
Darvemula, Ujjwala, and Mohammad K. Chowdhury. 2026. “Understanding the Behavior of Liquid Crystal Polymer (LCP) in Direct Laser Assisted Bonding (DLAB) for Wafer-Level Packaging of MEMS and Related Microsystems.” IMAPSource Proceedings 2008 (Symposium): 1183–89. https://doi.org/10.4071/001c.164931.