ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008June 26, 2026 EDT
Design of Bounding Head of IC Chip Bonder with Flexible Hinges Straight-line Buffer Mechanism
Design of Bounding Head of IC Chip Bonder with Flexible Hinges Straight-line Buffer Mechanism
Ketian, Li, Liu Ji’an, Chen Xin, and Weng Jizhao. 2026. “Design of Bounding Head of IC Chip Bonder with Flexible Hinges Straight-Line Buffer Mechanism.” IMAPSource Proceedings 2008 (Symposium): 138–43. https://doi.org/10.4071/001c.164098.