Thermoplastic Solutions for Photonics and Microelectronics Packaging

Scot MacGillivray

doi:10.4071/001c.164350

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MacGillivray, Scot. 2026. “Thermoplastic Solutions for Photonics and Microelectronics Packaging.” IMAPSource Proceedings 2008 (Symposium): 1016–19. https://doi.org/10.4071/001c.164350.

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