ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 28, 2026 EDT
IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages at Different Thermal Aging and Temperature Cycle Conditions
IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages at Different Thermal Aging and Temperature Cycle Conditions
Kim, Sang Ha, Hiroshi Tabuchi, Chika Kakegawa, and Han Park. 2026. “IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages at Different Thermal Aging and Temperature Cycle Conditions.” IMAPSource Proceedings 2008 (Symposium): 902–8. https://doi.org/10.4071/001c.165898.