ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 10, 2026 EDT
Wirebondability and Solderability of NiAu Electroless Front Side Metalized Silicon Wafers Subjected to High Temperature Back End Assembly Process Flows
Wirebondability and Solderability of NiAu Electroless Front Side Metalized Silicon Wafers Subjected to High Temperature Back End Assembly Process Flows
Herbsommer, J. A., Osvaldo Lopez, George Przybylek, Thorsten Teutsch, and Elke Zakel. 2026. “Wirebondability and Solderability of NiAu Electroless Front Side Metalized Silicon Wafers Subjected to High Temperature Back End Assembly Process Flows.” IMAPSource Proceedings 2008 (Symposium): 1190–95. https://doi.org/10.4071/001c.164932.