ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008June 26, 2026 EDT
Investigation on Statistical Distribution of Electromigration Lifetimes in Flip Chip Solder Bumps
Investigation on Statistical Distribution of Electromigration Lifetimes in Flip Chip Solder Bumps
Ding, Min, and Peng Su. 2026. “Investigation on Statistical Distribution of Electromigration Lifetimes in Flip Chip Solder Bumps.” IMAPSource Proceedings 2008 (Symposium): 178–85. https://doi.org/10.4071/001c.164110.