ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 20, 2026 EDT
Thermosonic Gold to Gold Flip Chip Bonding for Small Die High Density Interconnect
Thermosonic Gold to Gold Flip Chip Bonding for Small Die High Density Interconnect
Couts, Philip. 2026. “Thermosonic Gold to Gold Flip Chip Bonding for Small Die High Density Interconnect.” IMAPSource Proceedings 2008 (Symposium): 427–33. https://doi.org/10.4071/001c.165297.