Thermoelectric Device Packaging for High Reliability Aerospace Applications

Mike Gilley; John Mazurowski

doi:10.4071/001c.165744

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Gilley, Mike, and John Mazurowski. 2026. “Thermoelectric Device Packaging for High Reliability Aerospace Applications.” IMAPSource Proceedings 2008 (Symposium): 762–69. https://doi.org/10.4071/001c.165744.

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