SiC & GaN Die Attach for Extreme Environment Electronics

Kulkarni, Srikanth, Fred Barlow, Aicha Elshabini, and Rick Edgeman. 2026. “SiC & GaN Die Attach for Extreme Environment Electronics.” IMAPSource Proceedings 2008 (Symposium): 1119–25. https://doi.org/10.4071/001c.164873.