ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008June 30, 2026 EDT
Inter‐Wafer Inductors with Magnetic Core for 3D Power Delivery
Inter‐Wafer Inductors with Magnetic Core for 3D Power Delivery
Anderson, Mark, Guoyan Zhang, Zhengchun Liu, and Jian‐Qiang Lu. 2026. “Inter‐Wafer Inductors with Magnetic Core for 3D Power Delivery.” IMAPSource Proceedings 2008 (Symposium): 216–21. https://doi.org/10.4071/001c.164343.
