Effects of Thermo-compression Die Bond Residual Stress on MEMS Inertial Sensors

Ryan T. Marinis; Ryszard J. Pryputniewicz; Thomas F. Marinis; Joseph W. Soucy

doi:10.4071/001c.165461

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Marinis, Ryan T., Ryszard J. Pryputniewicz, Thomas F. Marinis, and Joseph W. Soucy. 2026. “Effects of Thermo-Compression Die Bond Residual Stress on MEMS Inertial Sensors.” IMAPSource Proceedings 2008 (Symposium): 621–28. https://doi.org/10.4071/001c.165461.

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