Thermal Stress Analysis in a Multilayer Power Module

R. K. Rajgarhia; B. McPherson; J. Hornberger; A. B. Lostetter; A. Saxena

doi:10.4071/001c.164876

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Rajgarhia, R. K., B. McPherson, J. Hornberger, A. B. Lostetter, and A. Saxena. 2026. “Thermal Stress Analysis in a Multilayer Power Module.” IMAPSource Proceedings 2008 (Symposium): 1134–40. https://doi.org/10.4071/001c.164876.

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