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ISSN 2380-4505
Symposium Proceedings
Vol. 2008, Issue Symposium, 2008July 21, 2026 EDT

Effects of Material Properties on Top PoP Package Warpage

Myung Jin Yim, Jason Brand, Ravi Kumar Adimula, Nanette Quevedo, Dejen Eshete, Cenon Dayawon, Eric Pike,
Package on PackagewarpageSMT yieldepoxy molding compoundmaterial property
https://doi.org/10.4071/001c.165359
IMAPSource Conference Papers
Yim, Myung Jin, Jason Brand, Ravi Kumar Adimula, Nanette Quevedo, Dejen Eshete, Cenon Dayawon, and Eric Pike. 2026. “Effects of Material Properties on Top PoP Package Warpage.” IMAPSource Proceedings 2008 (Symposium): 507–12. https://doi.org/10.4071/001c.165359.
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