ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 23, 2026 EDT
Bonding with Al Metallurgies for 200mm MEMS Devices
Bonding with Al Metallurgies for 200mm MEMS Devices
Articles in Vol. 2008, Issue Symposium, 2008
Vol. 2008, Issue Symposium, 2008
- Benchmarking of 96% Alumina Substrates for Thick Film HybridsDean BuzbySarah Groman
- Gold Wire for Room Temperature Wedge-Wedge BondingRainer DohleTobias MüllerHolger SchulzeEugen Milke
- Flipchip Reliability Improvements for an Automotive Sensor ApplicationGifford Plume
- Reliability of Embedded Large-Area High-K Dielectric Capacitors in LTCC SubstratesM. Ray FairchildK.M. NairM. McCombsMichael A. SkurskiPhillip S. Fisher
- Reliability Considerations of Inverter/DC Link Capacitor Using PP Film and 105°C Engine CoolantEd SawyerTed Von Kampen
- Wire Bond Comparison of Different Aluminum Alloys and ThicknessesBarry NjoesDavid W. M. WilliamsMichael McKeownJason HibbertAlex Marralaw
- Heavy Aluminum Wire Wedge Bonding on LTCC Substrate for Automotive ElectronicsJe-Hong SungJin-Waun KimYun-Huek Choi
- Using Embedded Capacitance to Improve Electrical Performance, Eliminate Capacitors and Reduce Board Size in High Speed Digital and RF ApplicationsJoel S. Peiffer
- Development of Thin LSI Embedded Circuit BoardsIsao MiyataniTsuyoshi TsunodaShinya AmakaiShuji Sagara
- Migrating Printed Wiring Board Assemblies into System in a Package (SiP)Steven G. RosserIrving MemisHarry Von Hofen
- New Niobium Pentoxide (Nb2O5) Integrated Capacitors for Decoupling ApplicationsSusan JacobLeonard W. Schaper
- The Design and Applications of Embedded Passives on Flexible PCB SubstratesSyun YuWei-Ting ChenChih-Yuan ChengKuo-Chiang ChinCheng-Hua TsaiRa-Min Tain
- Use of High Dk, Low Loss Composite Material as used for Embedded Capacitors in High Frequency ApplicationsJohn AndresakisJin HwangPranabes Pramanik
- Effects of Pre-pack Thermal Aging on the Formation and Evolution of IMC for Sn-Pb36-Ag2 and Sn-Ag3.8-Cu0.7 and it’s Correlation to Solder Joint StrengthR. VemalM. Hamdi
- The Effect of Solder Selection on High Platinum Palladium Silver Thick Film ConductorsSamson ShahbaziMeg TredinnickDavid Malanga
- Board Level Failure Analysis of Chip Scale Package Drop Test AssembliesNicholas VickersKyle RauenAndrew FarrisJianbiao Pan
- WLCSP Mechanical Reliability - High Speed Pull Testing (Lead-Free Solder Alloys and Electroless Nickel UBM)Andrew StrandjordThorsten TeutschAxel SchefflerThomas OppertElke Zakel
- Vibration Durability of Mixed Solder InterconnectsGustavo PlazaMichael OstermanMichael Pecht
- Drop Impact Dynamic Response Study of JEDEC JESD22-B111 Test BoardMichael KristJianbiao PanAndrew FarrisNicolas Vickers
- Construction of Prediction Model for the Wire Bonding Process through the ANFISJian GaoChanghong LiuXin ChenDetao Zheng
- Design of Bounding Head of IC Chip Bonder with Flexible Hinges Straight-line Buffer MechanismLi KetianLiu Ji’anChen XinWeng Jizhao
- Development of Epoxy Molding Compound for QFN PackageXinyu DuGuangchao XieJianglong HanJack ZhangShawn Liang
- Development and Application of SiP TechnologyZhengyi WangLangping LiHaiying Chen
- The Technology Research on AlN 3D MCMHao ZhangSong CuiJunyong Liu
- The Interfacial Structure Analysis of Aluminum Nitride Cofire Multi-layer Ceramic SubstrateYongda HuMing JiangBangchao YangSong CuiJingguo Zhang
- Modification to Darveaux Solder Joint Fatigue Life Prediction Method for Flip-Chip Solder JointsBahareh BanijamaliIlyas Mohammed
- Investigation on Statistical Distribution of Electromigration Lifetimes in Flip Chip Solder BumpsMin DingPeng Su
- Mechanical Properties Characterization of CuSn Intermetallics for Advanced Flip-Chip BondingW. ZhangW. Ruythooren
- Bend Testing Direct Chip Attach Bump Architectures with Stress Mode Correlated to Field-Wearout in Handheld ApplicationsMark R. LarsenIan R. HarveyAnthony P. CurtisTheodore G. Tessier
- A Comparative Study: Thermosonic Bonding of Flip Chips with Gold Stud Bumps to a Variety of Organic SubstratesNick StolperFei Ding
- 3-D VLSI Structure for High Power and High Speed ComputationY. LiuL. SchaperS. Burkett
- A New Idea to Manufacture High Density Packaging SubstrateChih Kuang Yang
- Inter‐Wafer Inductors with Magnetic Core for 3D Power DeliveryMark AndersonGuoyan ZhangZhengchun LiuJian‐Qiang Lu
- Temporary Wafer Bonding Materials with Adjustable Debonding Properties for Use in High-Temperature ProcessingDongshun BaiWenbin HongJoElle DachsteinerAmandine JouveRama PuligaddaChad BrubakerTian Tang
- Fabrication and Electrical Performance of Z-axis Interconnections: An Application of Nano-Micro-Filled Conducting AdhesivesVoya R. MarkovichRabindra N. DasMichael RowlandsJohn Lauffer
- Formation of Through-Silicon-Vias using Sn Filling Process for 3D PackagingSung-Kyu KimKyung-Won ParkMin-Young KimTae-Sung Oh
- Protoflight Model Development for Spaceborne LTCC RF-ModulesReinhard KulkeCarsten GünnerGregor MöllenbeckPeter UhligMatthias Rittweger
- Higher Speed Ethernet – 40 Gb/s and 100 Gb/s Copper Cable Assembly SpecificationsChristopher DiMinico
- Understanding the Role of Impurity Level in the Screen-Printed Front Silver Paste for High Sheet Resistance Emitter Silicon Solar CellsA. EbongA. RohatgiW. Zhang
- Thermoplastic Solutions for Photonics and Microelectronics PackagingScot MacGillivray
- AUTOMATION: The Means to High Reliability Aerospace Fiber Optic CablesAnthony J. ChristopherJohn MazurowskiDavid DittoDavid EnlowJeff SrogaMichael Hackert
- Micron Level Placement Accuracy Case Studies for Optoelectronic ComponentsZeger BokDaniel D. Evans Jr.
- The Effect of Ultrasonic Frequency on Gold Wire Bondability and ReliabilityJianbiao PanMinh-Nhat LeCuong Van (C.V.) Pham
- Thermosonic Gold Stud Bump Attach for Large ICs on Laminate SubstratesIan Hardy
- Electric NDT Method to Estimate Wirebond Pull ForceH. SeppänenA. MeriläinenM. OinonenE. Hæggström
- Systematical Pull and Shear Test Investigations on Very Small Bond Loops (wire ≤ 25 μm) and Innovative AlloysM. Schneider-RamelowJ.-M. Göhre
- Thick Al Ribbon Interconnects: A Feasible Solution for Power Devices PackagingWei Sun LohPearl A. AgyakwaC. Mark JohnsonTick-Kwang LohChristoph LuechingerKristian Oftebro
- Process Integrated Quality Control (PiQCTM) for Wire BondingRoberto GilardoniSebastian HagenkötterMichael Brökelmann
- Characterization of Die Attach Adhesives to Identify Contamination Source Present in MEMS PackagesJames M. HochreinSteven M. ThornbergMichael S. BakerJason R. BrownJohn A. MitchellMichael I. WhiteRichard W. Wavrik
- Electrical and Mechanical Properties of Carbon Nanotube Filled Adhesives on Lead Free PCB Surface FinishesKeerthivarma MantenaJanet K. LumppNaveen VelichetiMidhun JastiPoojitha Sirigiri
- Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradation in Epoxy Molding CompoundsM.H. ShirangiX.J. FanB. Michel
- Highly Reworkable Board-Level Underfill for Large PoP DevicesAlisha AdamsIan ColePaul MorganelliJoe FerreiraPatrick O’MalleyBryon StevensXinnan ZhangAndrew Collins
- Cooling Rate Dependent Underfill Fracture ToughnessSoojae ParkClaudius FegerEdel FarahMelania Doll
- Electrical, Microstructure and Rheology Properties of the Low-Curing-Temperature Silver Paste with Different Carbon-Chain Type Metallo-Organic Salt Wetting CoatingChun-An LuHong-Ching LinSea-Fue WangChung-Ying Jung
- Evaluation of DirectFET® Flip Chip Packaging Technology, Lead and Indium Solder Alloys in Extreme Cold Thermal EnvironmentsMartin BurmeisterAmin Mottiwala
- SiC & GaN Die Attach for Extreme Environment ElectronicsSrikanth KulkarniFred BarlowAicha ElshabiniRick Edgeman
- Efficient Gate Drive Mechanism for Novel Silicon Carbide Power FETsVijayaraghavan MadhuravasalPratibha KotaChriswell Hutchens
- Thermal Stress Analysis in a Multilayer Power ModuleR. K. RajgarhiaB. McPhersonJ. HornbergerA. B. LostetterA. Saxena
- Prototyping a SiC JFET Drop-in Replacement Module for a 600-V, 600-A Si IGBT Half-Bridge ModuleGuoyun TianMichael S. MazzolaMarshall MolenPaul MartinVlad BondarenkoJames R. GaffordChris J. ParkerLin Cheng
- Leakage Rates through LTCC Substrates for Extreme Environment ApplicationsKarl RinkFred BarlowAicha Elshabini
- Thermal Verification of a High-Temperature Power Package Utilizing Silicon Carbide DevicesR. ShawB. McPhersonJ. HornbergerA. LostetterK. OkumuraT. Otsuka
- Polyimide Restructuring: Application for Printed Leadfree Bump Integrity ImprovementRoden Topacio
- Low-k Interconnect Oriented Lead Free Sn-Cu Bump Process Integration with Sn/Cu Stack PlatingTadashi IijimaTatsuo MigitaTakashi TogasakiMasayuki MiuraToshistune IijimaKyoko KatoKazuhiro MurakamiMasahide GotoHiroyuki OohashiHiroki SakuraiKoro NagamineHirokazu Ezawa
- High Speed Dispensing Solutions for Packaging and ManufacturingB. LiP.A. ClarkK.M. StoneK.H. Church
- Enabling of Off-the-Shelf IC for Parallel Stochastic Self-AssemblyBernd ScholzYuriy AtanasovAndrew RoufsIsaac Graff
- Understanding the Behavior of Liquid Crystal Polymer (LCP) in Direct Laser Assisted Bonding (DLAB) for Wafer-level Packaging of MEMS and Related MicrosystemsUjjwala DarvemulaMohammad K. Chowdhury
- Wirebondability and Solderability of NiAu Electroless Front Side Metalized Silicon Wafers Subjected to High Temperature Back End Assembly Process FlowsJ. A. HerbsommerOsvaldo LopezGeorge PrzybylekThorsten TeutschElke Zakel
- Counterfeit Electronic Parts Detection through Packaging EvaluationKaushik ChatterjeeDiganta Das
- High Temperature Resistance Conductive Film for RF Grounding ApplicationsJing FanArt AckermanDoug KatzeJayesh ShahMatthew EvelineNishitha AndraDaniel Blazej
- Trade Off Between Speed and Defect Tolerance of QCA Designs in the Presence of Different Manufacturing DefectsSatyaki GangulyZ. Joan DelalicSon Nguyen
- Ceramics in Clean TechJohn OlenickViswanathan VenkateswaranGregory KorbutJames Newkirk
- Thick Film Heater for Aluminum Nitride CeramicsMelanie HentscheChristel KretzschmarHorst GrießmannPeter MarcinkowskiLars Rebenklau
- Modified Polypyrrole Nanowire Networks for Electrochemical SensorsJim ErwinD. Eric Aston
- Technology for Medical Human Implants: Vision Chip on Thin Film MultilayerA. KaiserK. RuessB. HollJ. VanselowE. FeurerL. LiuA. RothermelA. MöllerA. Harscher
- Flexible Interconnect and Packaging for MEMS Moveable Neural MicroelectrodesNathan JacksonJit Muthuswamy
- Computer Modeling of Induced Hyperthermia Using Superparamagnetic Iron Oxide Nanoparticles and their ApplicationChris ConklinSaroj BiswasFeroze B. MohamedScott H. FaroLinda KnightMarvin ZiskinDaniel StronginJoan Z. Delalic
- Laser Reflow: A Solution for Medical Electronics AssemblyJohn Vivari
- Analog Tetrode Adaptive Spike DetectorNadia BarakatIyad Obeid
- LTCC Based Microfluidic Structures for the Controlled Synthesis of Antioxidant PolymersWenli ZhangParitosh WattamwarKelly CummingsThomas DziublaRichard Eitel
- A JAVA Implementation of Modified Rapid Upper Limb AssessmentYaoyao HuangLi BaiJoan Zdenka DelalicJudith E. Gold
- Thermal Simulations for 4-Layer Stacked IC PackagesChih-Kuang YuChun-Kai LiuMing-Ji Dai Ming-Ji Dai
- BEOL Thermal Characterization for 3-D PackagingJ. WakilE. G. ColganL. JiangS. ChenK. Sikka
- Improvement of High-Power LED Performance with Sintered Chip AttachmentT. WangG. LeiG-Q. LuX. ChenL. Guido
- Alternative Cooling Solutions for High Power OptoelectronicMichael LeersHans SchmidtPhilipp Imgrund
- Flow Study in Magnetic Micro-Channel Heat PipeBang-Ji WangChia-Ray ChenJih-Run TsaiWen-Fang LeeChen-Hua ChenChing-Yao Chen
- A Method for Predicting Thermal Conductivity for LTCC with Various Via DensitiesTracey S. VincentPeter Barnwell
- Elimination of Surface Defects for Printable High Density Gold Conductor PastesDong ZhangBrian KistlerWeiming Zhang
- Response Surface Analysis and its Use to Predict LTCC Firing Shrinkage for RF MicroelectronicsMichael GirardiGregg BarnerCristie LopezBrent DuncanLarry Zawicki
- A New 3D Shaped, Monolithic PZT Beam Actuator Produced by Ceramic Injection MoldingMatthias HartmannSoeren HirschBertram Schmidt
- Full Tape Thickness Features for New Capabilities in LTCCRichard KnudsonGreg BarnerFrank SmithLarry ZawickiKen Peterson
- A Study of Thin Metal Film Formation on LTCC SubstrateYong-Suk KimByeung-Gyu ChangYong-Soo Oh
- Implementation of Gen2 RFID Tag with Data Storage to Log and Maintain Vehicle HistoryKavya KolluZ. Joan DelalicSai Nava Patanjali Seshabhattar
- 3-6 GHz Tunable Bandpass Filter using Heavily Loaded Evanescent-mode Cavity Resonators and Piezoelectric ActuatorsHjalti H. SigmarssonHimanshu JoshiDimitrios PeroulisWilliam J. Chappell
- Millimeter-wave Radio System In A PackageRick Sturdivant
- Designing Transitions Using Time Domain ReflectometryBill Rosas
- A Low Power 5.5 GHz Current Reuse LNA for Unlicensed National Information InfrastructureS. ToofanA. RahmatiM. CrepaldiA. AbrishamifarM. GrazianoM. R. CasuG. Roientan Lahiji
- Automatic Optical Inspection of Ceramic Thick Film, Thin Film Hybrids and LTCCsSabine Miksa
- Laser and Camera Inspection Technologies for On-Line Defect DetectionTimothy A. Potts
- An Alternative Green Packaging Solution in a fully Automated In-line Assembly-Test-Finish Operation for a Nickel-Palladium Gold (NiPdAu) Pre- Plated Frames Leadframe Based PackagesAlvin B. Denoyo
- Relationship of Cu Oxidation and Hardness towards Cratering in WirebondingLee Chai YingLee Cher ChiaLim Chee Chian
- Expanding Use of Onsite UHP Hydrogen Production Improves Safety, Quality and Productivity in Epitaxy OperationsDave Wolff
- ESD Solutions for a Class Ø FacilityKevin OuelletteCraig Blanchette
- Materials and Process Selection for High Frequency Flip ChipKatarina Boustedt
- Thermosonic Gold to Gold Flip Chip Bonding for Small Die High Density InterconnectPhilip Couts
- Electrochemical Process for Through Via 3D SiP without CMP and Lithographic ProcessesJae-Ho LeeSuk-Ei LeeSeong-Hun KimYun-Sung MoonYeong-Kwon KoKyoung-Jin Park
- Evaluation of Innovative Nano-Coated Stencils in Ultra-Fine-Pitch Flip Chip Bumping ProcessesDionysios ManessisRainer PatzeltAndreas OstmannRolf AschenbrennerHerbert ReichlAndreas AxmannCarmina LaentzschGeorg Kleemann
- Substrate Printing for Micro BGARita Mohanty
- Corrosion-Resistant Anisotropic Conductive Adhesive for Consumer Electronic ApplicationsBo XiaJayesh ShahWanda O'Hara
- Recent Advances in Board-Level Optical InterconnectionOsamu Mikami
- Ultra-Thin Packaging Technology for Cell PhonesTakaaki YoshihiroTakeshi ItoNobuhiro MikamiOsamu Furuse
- Packaging Technology for Recent Notebook PCsRyo KanaiNaoki NakamuraShigeru Sugino
- Study of Stress to Solder Joint by Underfill FillingAkira TanakaAkihiko HappoyaMichinobu InoueShun Okayama
- High Reliable Resin Core Bump Technology for 20μm pitch COG (Chip on Glass) InterconnectionHaruki ItoShuichi TanakaHideo ImaiShinji MizunoNobuaki HashimotoAkira Makabe
- Hybrid CSP Package Challenges and Solutions in Design and ManufacturingRoden TopacioYip Seng LowLiane Martinez
- Deposition of Ba(1-x)Ca(x)Ti(1-y)Zr(y)O(3) Films on HR-Si Substrate Using RF Sputtering by Design of Experiment MethodHsin-Hsien YehSheng-Hao ChangChiung-Hsiung ChenJiun-Jang YuYing-Chang HungTai-Bor Wu
- Effects of Material Properties on Top PoP Package WarpageMyung Jin YimJason BrandRavi Kumar AdimulaNanette QuevedoDejen EsheteCenon DayawonEric Pike
- Design and Thermal Management of a Miniaturized Radio in 3D PackageHongyu RanIlyas MohammedMatt Schwiebert
- Cu Wire Bond Reliability Improvement Through Focused Heat Treatment after BondingYow Kai YunEu Poh Leng
- Nano Electro-Machining (nano-EM): A Novel Method for Sculpting Nano Vias (< 20 nm) for Nanoscale PackagingAjay P. MalsheKumar R. VirwaniValliappa KalyanasundaramKamlakar P. Rajurkar
- Increasing IC Leadframe Package ReliabilityDan HartBruce LeeJohn Ganjei
- Parallel Parking Simulation Using MATLABJagadeesh Gowda
- RF MEMS Flip-chip Package Design: Finite Element Modeling and Experimental VerificationLi SunShawn CunninghamArt MorrisChangsoo JangBongtae Han
- Effect of Thermal Contact Conductance and Bond Line Thickness on Thermal Measurement Condition of Thermal Interface Material TesterTong Hong WangChang-Chi LeeYi-Shao LaiAndy Tseng
- Physical Boundaries of Gold and Copper Ball FormationAlon GanyBeni Sonnenreich
- RF System in Package Design for Portability Between Suppliers and Technology PlatformsChris Barratt
- A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component LevelEu Poh LengWong Tzu LingNowshad AminIbrahim Ahmad
- PB-Free Solder for Portable and High Temperature Electronic DevicesGanesh IyerEric OuyangWitoon KittidachaSuresh LK
- Degradation Mechanism of Conductive Adhesive/Sn Interface under High HumiditySun Sik KimKeun Soo KimSeong Jun KimKatsuaki Suganuma
- Lead-Free Solder Ball Attach Improvement on FCPBGA with SOP Pad FinishingWong Tzu LingEu Poh LengNowshad AminIbrahim Ahmad
- Mechanism of Whisker Growth caused by Corrosion of SolderYasuhide OhnoNoriyuki KuwanoKenichi InokuchiShunsuke HiranoMinoru Ueshima
- 3 Steps to Successful Solder Paste SelectionJohn Vivari
- True 3D Through Hole Interconnections Formed by Femto-second Laser Irradi-ation / Wet Etching and Molten Metal Suction MethodO. NukagaH. WakiokaS. YamamotoT. SuemasuH. Hashimoto
- Effects of Thermo-compression Die Bond Residual Stress on MEMS Inertial SensorsRyan T. MarinisRyszard J. PryputniewiczThomas F. MarinisJoseph W. Soucy
- Bonding with Al Metallurgies for 200mm MEMS DevicesShari FarrensMark FranklinSumant Sood
- Optical approach to NDT of MEMSRyszard J. PryputniewiczRyan T. MarinisPeter Hefti
- Thick Film Materials for Strain Gage ApplicationsJames L. Wood
- Fine Line Screen Printing of Thick Film Pastes on Silicon Solar CellsDean BuzbyArt Dobie
- Filler Dispersion in Epoxy Mold Compound and Its Effect on the Reliability of Cu/Low-k Devices in Plastic Ball Grid Array PackagesMin DingTu Anh TranSheila ChopinNick VoPeng Su
- Anomalous Reliability Behaviour of 99.99% and 99.999% Pure Aluminium Wire Bonds under Thermal CyclingP A AgyakwaW S LohM R CorfieldE LiottiS C HoggC M Johnson
- Manual Soldering Options for High Reliability ApplicationsJohn Vivari
- Overcoming Challenges in Thermally Enhanced BGA Packaging with Low-k SiliconTu Anh TranDavid DorinskiSimon GonzalesPhong VuRon Weberg
- Thermal Aging of Laminate Materials and the Maximum Use Temperature of Organic PackagesLaura L. KosbarClaudius FegerSoojae Park
- 3-D Corner Delamination Analysis for Fan-Out Chip Scale PackageTz-Cheng ChiuHuang-Chun LinStoke ChenG. S. Shen
- Challenges in Cavity-Down Thermally Enhanced Packages Containing Low-k DiesChu-Chung (Stephen) LeeTu Anh TranYuan Yuan
- Optimization of Probing Needle Design for Wafer-level Probing TestMeng-Kai ShihYi-Shao Lai
- Reliability Improvement of Resin Stress Buffer Layer TypeWafer Level Chip Size Package for Automotive ApplicationsShunpei OgayaShuichi TanakaHaruki ItoHirokazu ItoNobuaki Hashimoto
- Solderless Connection for Space Application: from DC to Microwave Frequency and Reliability ResultsP. MonfraixC. DrevonA. BoettiR. CironeJ.L. Cazaux
- Alternative Processing Methods for Copper Through Silicon ViasGayathri Devi JampanaLeonard W. SchaperIsi AbhulimenYang Liu
- Optimization of Redistributed Layers between Heterogeneous Devices for Wafer-Level IntegrationYutaka OnozukaAtsuko IidaHiroshi YamadaKazuhiko ItayaHideyuki Funaki
- Wafer Level Encapsulation of Micromachined Pressure Sensors to Realize a Liquid Flow SensorAli ShakirKrishnaswami SrihariBob MurckoChanghan YunBob Sulouff
- Board Level Reliability Testing of High-Rel Microprocessors Associated to ROHS Packaging SolutionsOlivier GaillardBenoît Dervaux
- Health Monitor System for Damage Assessment of Military AssetsBrian HatchellFred MaussJim SkorpikKurt Silvers
- Assessment of the Impacts of Packaging, Long-Term Storage, and Transportation on Military MEMSJ.L. Zunino IIID. R. Skelton
- Low CTE LCP for Ultra Low Stress Near Hermetic Package for MMIC ApplicationsFaheem F. FaheemMatthew S. Gruber
- Thermoelectric Device Packaging for High Reliability Aerospace ApplicationsMike GilleyJohn Mazurowski
- Wafer Level Packaging: Balancing Device Requirements and Materials PropertiesShari FarrensSumant Sood
- Understanding Power Integrity in System DesignsZhen Mu
- Estimation of Interconnect Models of SIP (System-in-Package) and POP (Package-on-Package) for IC-Package Co-Analysis and OptimizationEunseok SongYunhee LeeHeeseok LeeKiwon ChoiSa-Yoon Kang
- Novel Approach in Computing with Ultra-High Processing ThroughputSon NguyenJoan DelalicBjron GruenwaldPhil Monson
- LTCC Materials, Guidelines, and CAM and Test Output Integration for Electronic Design Automation (EDA)Tom DlouhyBrad ThrasherTim Mobley
- Studying the Interactions between Mushroom-type EBGs, Transmission Lines and ViasIvan NdipStephan GuttowskiHerbert Reichl
- High-Speed Indium Electrodeposition: Efficient, Reliable TIM TechnologyEdit SzöcsFelix SchwagerMichael TobenNathaniel Brese
- Thermal Resistance Characterization of a Nano-Graphite Composite Thermal Interface MaterialYan ZhangHongyu RanGuilian GaoDaniel RoitmanKen Honer
- Reaction Bonded Silicon Carbide Materials with Favorable Properties for Thermal Management ApplicationsA. L. MarshallM. K. AghajanianP. Karandikar
- Biocompatible Electrospun Titania-composite Nanofiber Networks for Whole Cell SensingJamie M.F. JabalAnjil GiriKurt E. GustinD. Eric Aston
- Comparison of Catalyst Performance for a Direct Methanol Fuel Cell Fabricated in Low Temperature Cofired Ceramics (LTCC)Yong GaoXiangxing KongKinzy Jones
- A Comparison Study Focused on the use of Electroplated Zinc Material as an Alternative to Electroplated Copper MaterialMichael J. Brouillard
- Engineering and Fabrications for Multiple-Submicron-Layer Clad MetalsLichun Leigh ChenPaula R. GoldsteinRobert P. Willis
- An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB InterconnectionsMichael J. RowlandsVara Calmidi
- Design of a High-performance Single Beam Contact for Demanding and Long Lifetime Applications in Industry and Telecom MarketsJan Broeksteeg
- 3M's Industry Leading High Speed Cable to Board SolutionsRichard J. SchererJames G. Vana Jr.Abhay A. Joshi
- Temperature Rise Measurement due to Joule Heating in a Stamped Metal Land Grid Array SocketVidyu ChallaMichael OstermanMichael PechtLeoncio Lopez
- High Density Interconnect for a High Pin Count Optical ICGerard KumsNienke BruinsmaJan Bex
- Low Thermal Expansion and High Heat Dissipation Printed Wiring BoardsSohei SamejimaSadao SatoTsuyoshi OzakiAtsushi InoueKentaro SuzukiHiroyuki OsugaKatsuaki Matsui
- Upgrading the Performance of Legacy Hard Metric Backplane Systems Using the 3M™ Ultra Hard Metric (UHM) ConnectorAlexander BarrJim VanaJohn BenedictWilliam Lee
- IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages at Different Thermal Aging and Temperature Cycle ConditionsSang Ha KimHiroshi TabuchiChika KakegawaHan Park
- Processing and Reliability Issues for Eutectic AuSn Solder JointsJohn C. McNulty
- Investigation of Fracture Toughness and Displacement Fields of Copper/Polymer Interface Using Image Correlation TechniqueM.H. ShirangiA. GollhardtA. FischerW.H. MüllerB. Michel
- Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead Free Soldering and Gold Wire BondingYukinori OdaMasayuki KisoSeigo KurosakaAkira OkadaKota KitajimaShigeo HashimotoGeorge MiladDon Gudeczauskas
- Methods for Providing a Dry Seal EnvironmentThomas E. Salzer
- Accelerated Degradation Test under Multiple Environmental Stresses and Reliability Estimation for Circular Electrical ConnectorsBo SunS K ZengRui KangS N ZhangM S Lu
- Packaging of GaAs Chips for Use in RF MCM ProductsCaroline K. BjuneThomas F. Marinis
- Bump on Flexible Lead for Wafer Level PackagingI. EidnerK. BuschickL. DietrichK. L. PanM. MinkusM. J. WolfO. EhrmannH. Reichl
- Inkjet Printed Interconnections on Flexible SubstratesEsa KunnariKimmo KaijaJani ValkamaPauliina Mansikkamäki
- A Comparison Study on SnAgNiCo and Sn3.8Ag0.7Cu C5 Lead Free Solder SystemEu Poh LengMin DingWong Tzu LingNowshad AminIbrahim AhmadMok Yong LeeA.S.M.A. Haseeb
- Vertical Interconnects Using Magnetically Aligned Anisotropic Conductive Adhesive for RF PackagingSungwook MoonWilliam J. Chappell
- Focused not “Complete Recall”Lonny Plummer
- Evaluation of the performance of a Silicate Based Thick Film Freon Gas Sensor Operating at 750 o C in Low Temperature Cofire CeramicsMary RualesKinzy JonesJaing Wang
- BGA Coplanarity Measurement by Laser Scanning Inspection EquipmentCui Guo YanYang Jian
- Dielectric Properties of Liquid Crystalline Polymers and BaTiO3-SrTiO3 Composites for Embedded Matching CapacitorsJin Cheol KimJun Rok Oh
- A Study of the Principle of Advanced Energy-Saving FurnacesXin LiangKen Kuang
Farrens, Shari, Mark Franklin, and Sumant Sood. 2026. “Bonding with Al Metallurgies for 200mm MEMS Devices.” IMAPSource Proceedings 2008 (Symposium): 629–32. https://doi.org/10.4071/001c.165462.