ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 09, 2026 EDT
Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradation in Epoxy Molding Compounds
Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradation in Epoxy Molding Compounds
Shirangi, M.H., X.J. Fan, and B. Michel. 2026. “Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradation in Epoxy Molding Compounds.” IMAPSource Proceedings 2008 (Symposium): 1082–89. https://doi.org/10.4071/001c.164867.