Thick Al Ribbon Interconnects: A Feasible Solution for Power Devices Packaging

Wei Sun Loh; Pearl A. Agyakwa; C. Mark Johnson; Tick-Kwang Loh; Christoph Luechinger; Kristian Oftebro

doi:10.4071/001c.164860

Loading [Contrib]/a11y/accessibility-menu.js

Loh, Wei Sun, Pearl A. Agyakwa, C. Mark Johnson, Tick-Kwang Loh, Christoph Luechinger, and Kristian Oftebro. 2026. “Thick Al Ribbon Interconnects: A Feasible Solution for Power Devices Packaging.” IMAPSource Proceedings 2008 (Symposium): 1056–63. https://doi.org/10.4071/001c.164860.

View more stats