ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008June 26, 2026 EDT
Bend Testing Direct Chip Attach Bump Architectures with Stress Mode Correlated to Field-Wearout in Handheld Applications
Bend Testing Direct Chip Attach Bump Architectures with Stress Mode Correlated to Field-Wearout in Handheld Applications
Larsen, Mark R., Ian R. Harvey, Anthony P. Curtis, and Theodore G. Tessier. 2026. “Bend Testing Direct Chip Attach Bump Architectures with Stress Mode Correlated to Field-Wearout in Handheld Applications.” IMAPSource Proceedings 2008 (Symposium): 190–97. https://doi.org/10.4071/001c.164112.