ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008June 26, 2026 EDT
Mechanical Properties Characterization of CuSn Intermetallics for Advanced Flip-Chip Bonding
Mechanical Properties Characterization of CuSn Intermetallics for Advanced Flip-Chip Bonding
Zhang, W., and W. Ruythooren. 2026. “Mechanical Properties Characterization of CuSn Intermetallics for Advanced Flip-Chip Bonding.” IMAPSource Proceedings 2008 (Symposium): 186–89. https://doi.org/10.4071/001c.164111.