Overcoming Challenges in Thermally Enhanced BGA Packaging with Low-k Silicon

Tu Anh Tran; David Dorinski; Simon Gonzales; Phong Vu; Ron Weberg

doi:10.4071/001c.165470

Loading [Contrib]/a11y/accessibility-menu.js

Tran, Tu Anh, David Dorinski, Simon Gonzales, Phong Vu, and Ron Weberg. 2026. “Overcoming Challenges in Thermally Enhanced BGA Packaging with Low-k Silicon.” IMAPSource Proceedings 2008 (Symposium): 672–79. https://doi.org/10.4071/001c.165470.

View more stats