Temporary Wafer Bonding Materials with Adjustable Debonding Properties for Use in High-Temperature Processing

Dongshun Bai; Wenbin Hong; JoElle Dachsteiner; Amandine Jouve; Rama Puligadda; Chad Brubaker; Tian Tang

doi:10.4071/001c.164344

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Bai, Dongshun, Wenbin Hong, JoElle Dachsteiner, Amandine Jouve, Rama Puligadda, Chad Brubaker, and Tian Tang. 2026. “Temporary Wafer Bonding Materials with Adjustable Debonding Properties for Use in High-Temperature Processing.” IMAPSource Proceedings 2008 (Symposium): 222–27. https://doi.org/10.4071/001c.164344.

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