Development of Epoxy Molding Compound for QFN Package

Xinyu Du; Guangchao Xie; Jianglong Han; Jack Zhang; Shawn Liang

doi:10.4071/001c.164100

Loading [Contrib]/a11y/accessibility-menu.js

Du, Xinyu, Guangchao Xie, Jianglong Han, Jack Zhang, and Shawn Liang. 2026. “Development of Epoxy Molding Compound for QFN Package.” IMAPSource Proceedings 2008 (Symposium): 144–50. https://doi.org/10.4071/001c.164100.

View more stats