Improvement of High-Power LED Performance with Sintered Chip Attachment

T. Wang; G. Lei; G-Q. Lu; X. Chen; L. Guido

doi:10.4071/001c.165060

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Wang, T., G. Lei, G-Q. Lu, X. Chen, and L. Guido. 2026. “Improvement of High-Power LED Performance with Sintered Chip Attachment.” IMAPSource Proceedings 2008 (Symposium): 296–301. https://doi.org/10.4071/001c.165060.

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