ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 14, 2026 EDT
Improvement of High-Power LED Performance with Sintered Chip Attachment
Improvement of High-Power LED Performance with Sintered Chip Attachment
Articles in Vol. 2008, Issue Symposium, 2008
Vol. 2008, Issue Symposium, 2008
- Benchmarking of 96% Alumina Substrates for Thick Film HybridsDean BuzbySarah Groman
- Gold Wire for Room Temperature Wedge-Wedge BondingRainer DohleTobias MüllerHolger SchulzeEugen Milke
- Flipchip Reliability Improvements for an Automotive Sensor ApplicationGifford Plume
- Reliability of Embedded Large-Area High-K Dielectric Capacitors in LTCC SubstratesM. Ray FairchildK.M. NairM. McCombsMichael A. SkurskiPhillip S. Fisher
- Reliability Considerations of Inverter/DC Link Capacitor Using PP Film and 105°C Engine CoolantEd SawyerTed Von Kampen
- Wire Bond Comparison of Different Aluminum Alloys and ThicknessesBarry NjoesDavid W. M. WilliamsMichael McKeownJason HibbertAlex Marralaw
- Heavy Aluminum Wire Wedge Bonding on LTCC Substrate for Automotive ElectronicsJe-Hong SungJin-Waun KimYun-Huek Choi
- Using Embedded Capacitance to Improve Electrical Performance, Eliminate Capacitors and Reduce Board Size in High Speed Digital and RF ApplicationsJoel S. Peiffer
- Development of Thin LSI Embedded Circuit BoardsIsao MiyataniTsuyoshi TsunodaShinya AmakaiShuji Sagara
- Migrating Printed Wiring Board Assemblies into System in a Package (SiP)Steven G. RosserIrving MemisHarry Von Hofen
- New Niobium Pentoxide (Nb2O5) Integrated Capacitors for Decoupling ApplicationsSusan JacobLeonard W. Schaper
- The Design and Applications of Embedded Passives on Flexible PCB SubstratesSyun YuWei-Ting ChenChih-Yuan ChengKuo-Chiang ChinCheng-Hua TsaiRa-Min Tain
- Use of High Dk, Low Loss Composite Material as used for Embedded Capacitors in High Frequency ApplicationsJohn AndresakisJin HwangPranabes Pramanik
- Effects of Pre-pack Thermal Aging on the Formation and Evolution of IMC for Sn-Pb36-Ag2 and Sn-Ag3.8-Cu0.7 and it’s Correlation to Solder Joint StrengthR. VemalM. Hamdi
- The Effect of Solder Selection on High Platinum Palladium Silver Thick Film ConductorsSamson ShahbaziMeg TredinnickDavid Malanga
- Board Level Failure Analysis of Chip Scale Package Drop Test AssembliesNicholas VickersKyle RauenAndrew FarrisJianbiao Pan
- WLCSP Mechanical Reliability - High Speed Pull Testing (Lead-Free Solder Alloys and Electroless Nickel UBM)Andrew StrandjordThorsten TeutschAxel SchefflerThomas OppertElke Zakel
- Vibration Durability of Mixed Solder InterconnectsGustavo PlazaMichael OstermanMichael Pecht
- Drop Impact Dynamic Response Study of JEDEC JESD22-B111 Test BoardMichael KristJianbiao PanAndrew FarrisNicolas Vickers
- Construction of Prediction Model for the Wire Bonding Process through the ANFISJian GaoChanghong LiuXin ChenDetao Zheng
- Design of Bounding Head of IC Chip Bonder with Flexible Hinges Straight-line Buffer MechanismLi KetianLiu Ji’anChen XinWeng Jizhao
- Development of Epoxy Molding Compound for QFN PackageXinyu DuGuangchao XieJianglong HanJack ZhangShawn Liang
- Development and Application of SiP TechnologyZhengyi WangLangping LiHaiying Chen
- The Technology Research on AlN 3D MCMHao ZhangSong CuiJunyong Liu
- The Interfacial Structure Analysis of Aluminum Nitride Cofire Multi-layer Ceramic SubstrateYongda HuMing JiangBangchao YangSong CuiJingguo Zhang
- Modification to Darveaux Solder Joint Fatigue Life Prediction Method for Flip-Chip Solder JointsBahareh BanijamaliIlyas Mohammed
- Investigation on Statistical Distribution of Electromigration Lifetimes in Flip Chip Solder BumpsMin DingPeng Su
- Mechanical Properties Characterization of CuSn Intermetallics for Advanced Flip-Chip BondingW. ZhangW. Ruythooren
- Bend Testing Direct Chip Attach Bump Architectures with Stress Mode Correlated to Field-Wearout in Handheld ApplicationsMark R. LarsenIan R. HarveyAnthony P. CurtisTheodore G. Tessier
- A Comparative Study: Thermosonic Bonding of Flip Chips with Gold Stud Bumps to a Variety of Organic SubstratesNick StolperFei Ding
- 3-D VLSI Structure for High Power and High Speed ComputationY. LiuL. SchaperS. Burkett
- A New Idea to Manufacture High Density Packaging SubstrateChih Kuang Yang
- Inter‐Wafer Inductors with Magnetic Core for 3D Power DeliveryMark AndersonGuoyan ZhangZhengchun LiuJian‐Qiang Lu
- Temporary Wafer Bonding Materials with Adjustable Debonding Properties for Use in High-Temperature ProcessingDongshun BaiWenbin HongJoElle DachsteinerAmandine JouveRama PuligaddaChad BrubakerTian Tang
- Fabrication and Electrical Performance of Z-axis Interconnections: An Application of Nano-Micro-Filled Conducting AdhesivesVoya R. MarkovichRabindra N. DasMichael RowlandsJohn Lauffer
- Formation of Through-Silicon-Vias using Sn Filling Process for 3D PackagingSung-Kyu KimKyung-Won ParkMin-Young KimTae-Sung Oh
- Protoflight Model Development for Spaceborne LTCC RF-ModulesReinhard KulkeCarsten GünnerGregor MöllenbeckPeter UhligMatthias Rittweger
- Higher Speed Ethernet – 40 Gb/s and 100 Gb/s Copper Cable Assembly SpecificationsChristopher DiMinico
- Understanding the Role of Impurity Level in the Screen-Printed Front Silver Paste for High Sheet Resistance Emitter Silicon Solar CellsA. EbongA. RohatgiW. Zhang
- Thermoplastic Solutions for Photonics and Microelectronics PackagingScot MacGillivray
- AUTOMATION: The Means to High Reliability Aerospace Fiber Optic CablesAnthony J. ChristopherJohn MazurowskiDavid DittoDavid EnlowJeff SrogaMichael Hackert
- Micron Level Placement Accuracy Case Studies for Optoelectronic ComponentsZeger BokDaniel D. Evans Jr.
- The Effect of Ultrasonic Frequency on Gold Wire Bondability and ReliabilityJianbiao PanMinh-Nhat LeCuong Van (C.V.) Pham
- Thermosonic Gold Stud Bump Attach for Large ICs on Laminate SubstratesIan Hardy
- Electric NDT Method to Estimate Wirebond Pull ForceH. SeppänenA. MeriläinenM. OinonenE. Hæggström
- Systematical Pull and Shear Test Investigations on Very Small Bond Loops (wire ≤ 25 μm) and Innovative AlloysM. Schneider-RamelowJ.-M. Göhre
- Thick Al Ribbon Interconnects: A Feasible Solution for Power Devices PackagingWei Sun LohPearl A. AgyakwaC. Mark JohnsonTick-Kwang LohChristoph LuechingerKristian Oftebro
- Process Integrated Quality Control (PiQCTM) for Wire BondingRoberto GilardoniSebastian HagenkötterMichael Brökelmann
- Characterization of Die Attach Adhesives to Identify Contamination Source Present in MEMS PackagesJames M. HochreinSteven M. ThornbergMichael S. BakerJason R. BrownJohn A. MitchellMichael I. WhiteRichard W. Wavrik
- Electrical and Mechanical Properties of Carbon Nanotube Filled Adhesives on Lead Free PCB Surface FinishesKeerthivarma MantenaJanet K. LumppNaveen VelichetiMidhun JastiPoojitha Sirigiri
- Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradation in Epoxy Molding CompoundsM.H. ShirangiX.J. FanB. Michel
- Highly Reworkable Board-Level Underfill for Large PoP DevicesAlisha AdamsIan ColePaul MorganelliJoe FerreiraPatrick O’MalleyBryon StevensXinnan ZhangAndrew Collins
- Cooling Rate Dependent Underfill Fracture ToughnessSoojae ParkClaudius FegerEdel FarahMelania Doll
- Electrical, Microstructure and Rheology Properties of the Low-Curing-Temperature Silver Paste with Different Carbon-Chain Type Metallo-Organic Salt Wetting CoatingChun-An LuHong-Ching LinSea-Fue WangChung-Ying Jung
- Evaluation of DirectFET® Flip Chip Packaging Technology, Lead and Indium Solder Alloys in Extreme Cold Thermal EnvironmentsMartin BurmeisterAmin Mottiwala
- SiC & GaN Die Attach for Extreme Environment ElectronicsSrikanth KulkarniFred BarlowAicha ElshabiniRick Edgeman
- Efficient Gate Drive Mechanism for Novel Silicon Carbide Power FETsVijayaraghavan MadhuravasalPratibha KotaChriswell Hutchens
- Thermal Stress Analysis in a Multilayer Power ModuleR. K. RajgarhiaB. McPhersonJ. HornbergerA. B. LostetterA. Saxena
- Prototyping a SiC JFET Drop-in Replacement Module for a 600-V, 600-A Si IGBT Half-Bridge ModuleGuoyun TianMichael S. MazzolaMarshall MolenPaul MartinVlad BondarenkoJames R. GaffordChris J. ParkerLin Cheng
- Leakage Rates through LTCC Substrates for Extreme Environment ApplicationsKarl RinkFred BarlowAicha Elshabini
- Thermal Verification of a High-Temperature Power Package Utilizing Silicon Carbide DevicesR. ShawB. McPhersonJ. HornbergerA. LostetterK. OkumuraT. Otsuka
- Polyimide Restructuring: Application for Printed Leadfree Bump Integrity ImprovementRoden Topacio
- Low-k Interconnect Oriented Lead Free Sn-Cu Bump Process Integration with Sn/Cu Stack PlatingTadashi IijimaTatsuo MigitaTakashi TogasakiMasayuki MiuraToshistune IijimaKyoko KatoKazuhiro MurakamiMasahide GotoHiroyuki OohashiHiroki SakuraiKoro NagamineHirokazu Ezawa
- High Speed Dispensing Solutions for Packaging and ManufacturingB. LiP.A. ClarkK.M. StoneK.H. Church
- Enabling of Off-the-Shelf IC for Parallel Stochastic Self-AssemblyBernd ScholzYuriy AtanasovAndrew RoufsIsaac Graff
- Understanding the Behavior of Liquid Crystal Polymer (LCP) in Direct Laser Assisted Bonding (DLAB) for Wafer-level Packaging of MEMS and Related MicrosystemsUjjwala DarvemulaMohammad K. Chowdhury
- Wirebondability and Solderability of NiAu Electroless Front Side Metalized Silicon Wafers Subjected to High Temperature Back End Assembly Process FlowsJ. A. HerbsommerOsvaldo LopezGeorge PrzybylekThorsten TeutschElke Zakel
- Counterfeit Electronic Parts Detection through Packaging EvaluationKaushik ChatterjeeDiganta Das
- High Temperature Resistance Conductive Film for RF Grounding ApplicationsJing FanArt AckermanDoug KatzeJayesh ShahMatthew EvelineNishitha AndraDaniel Blazej
- Trade Off Between Speed and Defect Tolerance of QCA Designs in the Presence of Different Manufacturing DefectsSatyaki GangulyZ. Joan DelalicSon Nguyen
- Ceramics in Clean TechJohn OlenickViswanathan VenkateswaranGregory KorbutJames Newkirk
- Thick Film Heater for Aluminum Nitride CeramicsMelanie HentscheChristel KretzschmarHorst GrießmannPeter MarcinkowskiLars Rebenklau
- Modified Polypyrrole Nanowire Networks for Electrochemical SensorsJim ErwinD. Eric Aston
- Technology for Medical Human Implants: Vision Chip on Thin Film MultilayerA. KaiserK. RuessB. HollJ. VanselowE. FeurerL. LiuA. RothermelA. MöllerA. Harscher
- Flexible Interconnect and Packaging for MEMS Moveable Neural MicroelectrodesNathan JacksonJit Muthuswamy
- Computer Modeling of Induced Hyperthermia Using Superparamagnetic Iron Oxide Nanoparticles and their ApplicationChris ConklinSaroj BiswasFeroze B. MohamedScott H. FaroLinda KnightMarvin ZiskinDaniel StronginJoan Z. Delalic
- Laser Reflow: A Solution for Medical Electronics AssemblyJohn Vivari
- Analog Tetrode Adaptive Spike DetectorNadia BarakatIyad Obeid
- LTCC Based Microfluidic Structures for the Controlled Synthesis of Antioxidant PolymersWenli ZhangParitosh WattamwarKelly CummingsThomas DziublaRichard Eitel
- A JAVA Implementation of Modified Rapid Upper Limb AssessmentYaoyao HuangLi BaiJoan Zdenka DelalicJudith E. Gold
- Thermal Simulations for 4-Layer Stacked IC PackagesChih-Kuang YuChun-Kai LiuMing-Ji Dai Ming-Ji Dai
- BEOL Thermal Characterization for 3-D PackagingJ. WakilE. G. ColganL. JiangS. ChenK. Sikka
- Improvement of High-Power LED Performance with Sintered Chip AttachmentT. WangG. LeiG-Q. LuX. ChenL. Guido
- Alternative Cooling Solutions for High Power OptoelectronicMichael LeersHans SchmidtPhilipp Imgrund
- Flow Study in Magnetic Micro-Channel Heat PipeBang-Ji WangChia-Ray ChenJih-Run TsaiWen-Fang LeeChen-Hua ChenChing-Yao Chen
- A Method for Predicting Thermal Conductivity for LTCC with Various Via DensitiesTracey S. VincentPeter Barnwell
- Elimination of Surface Defects for Printable High Density Gold Conductor PastesDong ZhangBrian KistlerWeiming Zhang
- Response Surface Analysis and its Use to Predict LTCC Firing Shrinkage for RF MicroelectronicsMichael GirardiGregg BarnerCristie LopezBrent DuncanLarry Zawicki
- A New 3D Shaped, Monolithic PZT Beam Actuator Produced by Ceramic Injection MoldingMatthias HartmannSoeren HirschBertram Schmidt
- Full Tape Thickness Features for New Capabilities in LTCCRichard KnudsonGreg BarnerFrank SmithLarry ZawickiKen Peterson
- A Study of Thin Metal Film Formation on LTCC SubstrateYong-Suk KimByeung-Gyu ChangYong-Soo Oh
- Implementation of Gen2 RFID Tag with Data Storage to Log and Maintain Vehicle HistoryKavya KolluZ. Joan DelalicSai Nava Patanjali Seshabhattar
- 3-6 GHz Tunable Bandpass Filter using Heavily Loaded Evanescent-mode Cavity Resonators and Piezoelectric ActuatorsHjalti H. SigmarssonHimanshu JoshiDimitrios PeroulisWilliam J. Chappell
- Millimeter-wave Radio System In A PackageRick Sturdivant
- Designing Transitions Using Time Domain ReflectometryBill Rosas
- A Low Power 5.5 GHz Current Reuse LNA for Unlicensed National Information InfrastructureS. ToofanA. RahmatiM. CrepaldiA. AbrishamifarM. GrazianoM. R. CasuG. Roientan Lahiji
- Automatic Optical Inspection of Ceramic Thick Film, Thin Film Hybrids and LTCCsSabine Miksa
- Laser and Camera Inspection Technologies for On-Line Defect DetectionTimothy A. Potts
- An Alternative Green Packaging Solution in a fully Automated In-line Assembly-Test-Finish Operation for a Nickel-Palladium Gold (NiPdAu) Pre- Plated Frames Leadframe Based PackagesAlvin B. Denoyo
- Relationship of Cu Oxidation and Hardness towards Cratering in WirebondingLee Chai YingLee Cher ChiaLim Chee Chian
- Expanding Use of Onsite UHP Hydrogen Production Improves Safety, Quality and Productivity in Epitaxy OperationsDave Wolff
- ESD Solutions for a Class Ø FacilityKevin OuelletteCraig Blanchette
- Materials and Process Selection for High Frequency Flip ChipKatarina Boustedt
- Thermosonic Gold to Gold Flip Chip Bonding for Small Die High Density InterconnectPhilip Couts
- Electrochemical Process for Through Via 3D SiP without CMP and Lithographic ProcessesJae-Ho LeeSuk-Ei LeeSeong-Hun KimYun-Sung MoonYeong-Kwon KoKyoung-Jin Park
- Evaluation of Innovative Nano-Coated Stencils in Ultra-Fine-Pitch Flip Chip Bumping ProcessesDionysios ManessisRainer PatzeltAndreas OstmannRolf AschenbrennerHerbert ReichlAndreas AxmannCarmina LaentzschGeorg Kleemann
- Substrate Printing for Micro BGARita Mohanty
- Corrosion-Resistant Anisotropic Conductive Adhesive for Consumer Electronic ApplicationsBo XiaJayesh ShahWanda O'Hara
- Recent Advances in Board-Level Optical InterconnectionOsamu Mikami
- Ultra-Thin Packaging Technology for Cell PhonesTakaaki YoshihiroTakeshi ItoNobuhiro MikamiOsamu Furuse
- Packaging Technology for Recent Notebook PCsRyo KanaiNaoki NakamuraShigeru Sugino
- Study of Stress to Solder Joint by Underfill FillingAkira TanakaAkihiko HappoyaMichinobu InoueShun Okayama
- High Reliable Resin Core Bump Technology for 20μm pitch COG (Chip on Glass) InterconnectionHaruki ItoShuichi TanakaHideo ImaiShinji MizunoNobuaki HashimotoAkira Makabe
- Hybrid CSP Package Challenges and Solutions in Design and ManufacturingRoden TopacioYip Seng LowLiane Martinez
- Deposition of Ba(1-x)Ca(x)Ti(1-y)Zr(y)O(3) Films on HR-Si Substrate Using RF Sputtering by Design of Experiment MethodHsin-Hsien YehSheng-Hao ChangChiung-Hsiung ChenJiun-Jang YuYing-Chang HungTai-Bor Wu
- Effects of Material Properties on Top PoP Package WarpageMyung Jin YimJason BrandRavi Kumar AdimulaNanette QuevedoDejen EsheteCenon DayawonEric Pike
- Design and Thermal Management of a Miniaturized Radio in 3D PackageHongyu RanIlyas MohammedMatt Schwiebert
- Cu Wire Bond Reliability Improvement Through Focused Heat Treatment after BondingYow Kai YunEu Poh Leng
- Nano Electro-Machining (nano-EM): A Novel Method for Sculpting Nano Vias (< 20 nm) for Nanoscale PackagingAjay P. MalsheKumar R. VirwaniValliappa KalyanasundaramKamlakar P. Rajurkar
- Increasing IC Leadframe Package ReliabilityDan HartBruce LeeJohn Ganjei
- Parallel Parking Simulation Using MATLABJagadeesh Gowda
- RF MEMS Flip-chip Package Design: Finite Element Modeling and Experimental VerificationLi SunShawn CunninghamArt MorrisChangsoo JangBongtae Han
- Effect of Thermal Contact Conductance and Bond Line Thickness on Thermal Measurement Condition of Thermal Interface Material TesterTong Hong WangChang-Chi LeeYi-Shao LaiAndy Tseng
- Physical Boundaries of Gold and Copper Ball FormationAlon GanyBeni Sonnenreich
- RF System in Package Design for Portability Between Suppliers and Technology PlatformsChris Barratt
- A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component LevelEu Poh LengWong Tzu LingNowshad AminIbrahim Ahmad
- PB-Free Solder for Portable and High Temperature Electronic DevicesGanesh IyerEric OuyangWitoon KittidachaSuresh LK
- Degradation Mechanism of Conductive Adhesive/Sn Interface under High HumiditySun Sik KimKeun Soo KimSeong Jun KimKatsuaki Suganuma
- Lead-Free Solder Ball Attach Improvement on FCPBGA with SOP Pad FinishingWong Tzu LingEu Poh LengNowshad AminIbrahim Ahmad
- Mechanism of Whisker Growth caused by Corrosion of SolderYasuhide OhnoNoriyuki KuwanoKenichi InokuchiShunsuke HiranoMinoru Ueshima
- 3 Steps to Successful Solder Paste SelectionJohn Vivari
- True 3D Through Hole Interconnections Formed by Femto-second Laser Irradi-ation / Wet Etching and Molten Metal Suction MethodO. NukagaH. WakiokaS. YamamotoT. SuemasuH. Hashimoto
- Effects of Thermo-compression Die Bond Residual Stress on MEMS Inertial SensorsRyan T. MarinisRyszard J. PryputniewiczThomas F. MarinisJoseph W. Soucy
- Bonding with Al Metallurgies for 200mm MEMS DevicesShari FarrensMark FranklinSumant Sood
- Optical approach to NDT of MEMSRyszard J. PryputniewiczRyan T. MarinisPeter Hefti
- Thick Film Materials for Strain Gage ApplicationsJames L. Wood
- Fine Line Screen Printing of Thick Film Pastes on Silicon Solar CellsDean BuzbyArt Dobie
- Filler Dispersion in Epoxy Mold Compound and Its Effect on the Reliability of Cu/Low-k Devices in Plastic Ball Grid Array PackagesMin DingTu Anh TranSheila ChopinNick VoPeng Su
- Anomalous Reliability Behaviour of 99.99% and 99.999% Pure Aluminium Wire Bonds under Thermal CyclingP A AgyakwaW S LohM R CorfieldE LiottiS C HoggC M Johnson
- Manual Soldering Options for High Reliability ApplicationsJohn Vivari
- Overcoming Challenges in Thermally Enhanced BGA Packaging with Low-k SiliconTu Anh TranDavid DorinskiSimon GonzalesPhong VuRon Weberg
- Thermal Aging of Laminate Materials and the Maximum Use Temperature of Organic PackagesLaura L. KosbarClaudius FegerSoojae Park
- 3-D Corner Delamination Analysis for Fan-Out Chip Scale PackageTz-Cheng ChiuHuang-Chun LinStoke ChenG. S. Shen
- Challenges in Cavity-Down Thermally Enhanced Packages Containing Low-k DiesChu-Chung (Stephen) LeeTu Anh TranYuan Yuan
- Optimization of Probing Needle Design for Wafer-level Probing TestMeng-Kai ShihYi-Shao Lai
- Reliability Improvement of Resin Stress Buffer Layer TypeWafer Level Chip Size Package for Automotive ApplicationsShunpei OgayaShuichi TanakaHaruki ItoHirokazu ItoNobuaki Hashimoto
- Solderless Connection for Space Application: from DC to Microwave Frequency and Reliability ResultsP. MonfraixC. DrevonA. BoettiR. CironeJ.L. Cazaux
- Alternative Processing Methods for Copper Through Silicon ViasGayathri Devi JampanaLeonard W. SchaperIsi AbhulimenYang Liu
- Optimization of Redistributed Layers between Heterogeneous Devices for Wafer-Level IntegrationYutaka OnozukaAtsuko IidaHiroshi YamadaKazuhiko ItayaHideyuki Funaki
- Wafer Level Encapsulation of Micromachined Pressure Sensors to Realize a Liquid Flow SensorAli ShakirKrishnaswami SrihariBob MurckoChanghan YunBob Sulouff
- Board Level Reliability Testing of High-Rel Microprocessors Associated to ROHS Packaging SolutionsOlivier GaillardBenoît Dervaux
- Health Monitor System for Damage Assessment of Military AssetsBrian HatchellFred MaussJim SkorpikKurt Silvers
- Assessment of the Impacts of Packaging, Long-Term Storage, and Transportation on Military MEMSJ.L. Zunino IIID. R. Skelton
- Low CTE LCP for Ultra Low Stress Near Hermetic Package for MMIC ApplicationsFaheem F. FaheemMatthew S. Gruber
- Thermoelectric Device Packaging for High Reliability Aerospace ApplicationsMike GilleyJohn Mazurowski
- Wafer Level Packaging: Balancing Device Requirements and Materials PropertiesShari FarrensSumant Sood
- Understanding Power Integrity in System DesignsZhen Mu
- Estimation of Interconnect Models of SIP (System-in-Package) and POP (Package-on-Package) for IC-Package Co-Analysis and OptimizationEunseok SongYunhee LeeHeeseok LeeKiwon ChoiSa-Yoon Kang
- Novel Approach in Computing with Ultra-High Processing ThroughputSon NguyenJoan DelalicBjron GruenwaldPhil Monson
- LTCC Materials, Guidelines, and CAM and Test Output Integration for Electronic Design Automation (EDA)Tom DlouhyBrad ThrasherTim Mobley
- Studying the Interactions between Mushroom-type EBGs, Transmission Lines and ViasIvan NdipStephan GuttowskiHerbert Reichl
- High-Speed Indium Electrodeposition: Efficient, Reliable TIM TechnologyEdit SzöcsFelix SchwagerMichael TobenNathaniel Brese
- Thermal Resistance Characterization of a Nano-Graphite Composite Thermal Interface MaterialYan ZhangHongyu RanGuilian GaoDaniel RoitmanKen Honer
- Reaction Bonded Silicon Carbide Materials with Favorable Properties for Thermal Management ApplicationsA. L. MarshallM. K. AghajanianP. Karandikar
- Biocompatible Electrospun Titania-composite Nanofiber Networks for Whole Cell SensingJamie M.F. JabalAnjil GiriKurt E. GustinD. Eric Aston
- Comparison of Catalyst Performance for a Direct Methanol Fuel Cell Fabricated in Low Temperature Cofired Ceramics (LTCC)Yong GaoXiangxing KongKinzy Jones
- A Comparison Study Focused on the use of Electroplated Zinc Material as an Alternative to Electroplated Copper MaterialMichael J. Brouillard
- Engineering and Fabrications for Multiple-Submicron-Layer Clad MetalsLichun Leigh ChenPaula R. GoldsteinRobert P. Willis
- An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB InterconnectionsMichael J. RowlandsVara Calmidi
- Design of a High-performance Single Beam Contact for Demanding and Long Lifetime Applications in Industry and Telecom MarketsJan Broeksteeg
- 3M's Industry Leading High Speed Cable to Board SolutionsRichard J. SchererJames G. Vana Jr.Abhay A. Joshi
- Temperature Rise Measurement due to Joule Heating in a Stamped Metal Land Grid Array SocketVidyu ChallaMichael OstermanMichael PechtLeoncio Lopez
- High Density Interconnect for a High Pin Count Optical ICGerard KumsNienke BruinsmaJan Bex
- Low Thermal Expansion and High Heat Dissipation Printed Wiring BoardsSohei SamejimaSadao SatoTsuyoshi OzakiAtsushi InoueKentaro SuzukiHiroyuki OsugaKatsuaki Matsui
- Upgrading the Performance of Legacy Hard Metric Backplane Systems Using the 3M™ Ultra Hard Metric (UHM) ConnectorAlexander BarrJim VanaJohn BenedictWilliam Lee
- IMC Growth Mechanisms of SAC305 Lead-Free Solder on Different Surface Finishes and Their Effects on Solder Joint Reliability of FCBGA Packages at Different Thermal Aging and Temperature Cycle ConditionsSang Ha KimHiroshi TabuchiChika KakegawaHan Park
- Processing and Reliability Issues for Eutectic AuSn Solder JointsJohn C. McNulty
- Investigation of Fracture Toughness and Displacement Fields of Copper/Polymer Interface Using Image Correlation TechniqueM.H. ShirangiA. GollhardtA. FischerW.H. MüllerB. Michel
- Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead Free Soldering and Gold Wire BondingYukinori OdaMasayuki KisoSeigo KurosakaAkira OkadaKota KitajimaShigeo HashimotoGeorge MiladDon Gudeczauskas
- Methods for Providing a Dry Seal EnvironmentThomas E. Salzer
- Accelerated Degradation Test under Multiple Environmental Stresses and Reliability Estimation for Circular Electrical ConnectorsBo SunS K ZengRui KangS N ZhangM S Lu
- Packaging of GaAs Chips for Use in RF MCM ProductsCaroline K. BjuneThomas F. Marinis
- Bump on Flexible Lead for Wafer Level PackagingI. EidnerK. BuschickL. DietrichK. L. PanM. MinkusM. J. WolfO. EhrmannH. Reichl
- Inkjet Printed Interconnections on Flexible SubstratesEsa KunnariKimmo KaijaJani ValkamaPauliina Mansikkamäki
- A Comparison Study on SnAgNiCo and Sn3.8Ag0.7Cu C5 Lead Free Solder SystemEu Poh LengMin DingWong Tzu LingNowshad AminIbrahim AhmadMok Yong LeeA.S.M.A. Haseeb
- Vertical Interconnects Using Magnetically Aligned Anisotropic Conductive Adhesive for RF PackagingSungwook MoonWilliam J. Chappell
- Focused not “Complete Recall”Lonny Plummer
- Evaluation of the performance of a Silicate Based Thick Film Freon Gas Sensor Operating at 750 o C in Low Temperature Cofire CeramicsMary RualesKinzy JonesJaing Wang
- BGA Coplanarity Measurement by Laser Scanning Inspection EquipmentCui Guo YanYang Jian
- Dielectric Properties of Liquid Crystalline Polymers and BaTiO3-SrTiO3 Composites for Embedded Matching CapacitorsJin Cheol KimJun Rok Oh
- A Study of the Principle of Advanced Energy-Saving FurnacesXin LiangKen Kuang
Wang, T., G. Lei, G-Q. Lu, X. Chen, and L. Guido. 2026. “Improvement of High-Power LED Performance with Sintered Chip Attachment.” IMAPSource Proceedings 2008 (Symposium): 296–301. https://doi.org/10.4071/001c.165060.