ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 15, 2026 EDT
Relationship of Cu Oxidation and Hardness towards Cratering in Wirebonding
Relationship of Cu Oxidation and Hardness towards Cratering in Wirebonding
Ying, Lee Chai, Lee Cher Chia, and Lim Chee Chian. 2026. “Relationship of Cu Oxidation and Hardness towards Cratering in Wirebonding.” IMAPSource Proceedings 2008 (Symposium): 397–404. https://doi.org/10.4071/001c.165135.
