ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 21, 2026 EDT
Effect of Thermal Contact Conductance and Bond Line Thickness on Thermal Measurement Condition of Thermal Interface Material Tester
Effect of Thermal Contact Conductance and Bond Line Thickness on Thermal Measurement Condition of Thermal Interface Material Tester
Wang, Tong Hong, Chang-Chi Lee, Yi-Shao Lai, and Andy Tseng. 2026. “Effect of Thermal Contact Conductance and Bond Line Thickness on Thermal Measurement Condition of Thermal Interface Material Tester.” IMAPSource Proceedings 2008 (Symposium): 553–57. https://doi.org/10.4071/001c.165369.