Cu Wire Bond Reliability Improvement Through Focused Heat Treatment after Bonding

Yow Kai Yun; Eu Poh Leng

doi:10.4071/001c.165362

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Yun, Yow Kai, and Eu Poh Leng. 2026. “Cu Wire Bond Reliability Improvement Through Focused Heat Treatment after Bonding.” IMAPSource Proceedings 2008 (Symposium): 520–26. https://doi.org/10.4071/001c.165362.

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