ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 10, 2026 EDT
Polyimide Restructuring: Application for Printed Leadfree Bump Integrity Improvement
Polyimide Restructuring: Application for Printed Leadfree Bump Integrity Improvement
Topacio, Roden. 2026. “Polyimide Restructuring: Application for Printed Leadfree Bump Integrity Improvement.” IMAPSource Proceedings 2008 (Symposium): 1160–64. https://doi.org/10.4071/001c.164927.