The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability

Jianbiao Pan; Minh-Nhat Le; Cuong Van (C.V.) Pham

doi:10.4071/001c.164848

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Pan, Jianbiao, Minh-Nhat Le, and Cuong Van (C.V.) Pham. 2026. “The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability.” IMAPSource Proceedings 2008 (Symposium): 1034–41. https://doi.org/10.4071/001c.164848.

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