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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2025, Issue DPC, 2025December 08, 2025 EDT

Advanced High-Density Substrates and Circuits Leveraging Liquid Crystal Polymer and Ultra-Low Loss Dielectrics for High-Speed Digital and RFMW applications

Jim Rathburn,
circuit fabrication processesLiquid Crystal PolymerUltra-Low_Loss dielectric materials
https://doi.org/10.4071/001c.154009
IMAPSource Conference Papers
Rathburn, Jim. 2025. “Advanced High-Density Substrates and Circuits Leveraging Liquid Crystal Polymer and Ultra-Low Loss Dielectrics for High-Speed Digital and RFMW Applications.” IMAPSource Proceedings 2025 (DPC): 1163–85. https:/​/​doi.org/​10.4071/​001c.154009.

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