ISSN 2380-4505
Vol. 2025, Issue DPC, 2025November 19, 2025 EDT
Panel Level Package: Reliability Evaluation of Double-sided Direct Copper Plated Interconnects on Embedded Power Die by Thermal and Electrical Stress Test
Panel Level Package: Reliability Evaluation of Double-sided Direct Copper Plated Interconnects on Embedded Power Die by Thermal and Electrical Stress Test
Takao, Katsuhiro, Yuki Matsue, Koji Iwabu, Atsushi Kuroha, Michihito Kawada, Ichiro Kono, Takashi Suzuki, and Yoshiaki Aizawa. 2025. “Panel Level Package: Reliability Evaluation of Double-Sided Direct Copper Plated Interconnects on Embedded Power Die by Thermal and Electrical Stress Test.” IMAPSource Proceedings 2025 (DPC): 106–30. https://doi.org/10.4071/001c.151188.