ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 02, 2025 EDT
Enabling High Aspect-Ratio Interconnects for Advanced Packaging of MEMS and Sensors
Enabling High Aspect-Ratio Interconnects for Advanced Packaging of MEMS and Sensors
Matt Weimer, Irina Stateikina, Sara Harris, Dane Lindbland, Marc Guilmain, Xavier Gaudreau-Miron, Arrelaine Dameron,
Weimer, Matt, Irina Stateikina, Sara Harris, Dane Lindbland, Marc Guilmain, Xavier Gaudreau-Miron, and Arrelaine Dameron. 2025. “Enabling High Aspect-Ratio Interconnects for Advanced Packaging of MEMS and Sensors.” IMAPSource Proceedings 2025 (DPC): 734–57. https://doi.org/10.4071/001c.151782.