ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 01, 2025 EDT
Through Glass Via (TGV) Etching on Glass Core Substrates for High Density 3D Advanced Packaging Applications
Through Glass Via (TGV) Etching on Glass Core Substrates for High Density 3D Advanced Packaging Applications
Govindarajulu, Venu, Coby Tao, Zia Karim, Vengal Jalagam, Keshav Chandran, and Jeffrey Vu. 2025. “Through Glass Via (TGV) Etching on Glass Core Substrates for High Density 3D Advanced Packaging Applications.” IMAPSource Proceedings 2025 (DPC): 311–30. https://doi.org/10.4071/001c.151704.