ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 02, 2025 EDT
Study of 10micron Pitch Interconnect Bonding of Heterogeneous Materials for High Resolution SWIR Imagers
Study of 10micron Pitch Interconnect Bonding of Heterogeneous Materials for High Resolution SWIR Imagers
Vereecke, Bart, Gauri Karve, Naresh Chandrasekaran, Jaber Derakhshandeh, Aurore Luu, Barundeb Dutta, and Aurélien Griffart. 2025. “Study of 10micron Pitch Interconnect Bonding of Heterogeneous Materials for High Resolution SWIR Imagers.” IMAPSource Proceedings 2025 (DPC): 445–73. https://doi.org/10.4071/001c.151765.