ISSN 2380-4505
Articles in Vol. 2025, Issue DPC, 2025
Vol. 2025, Issue DPC, 2025
- Advanced High-Density Substrates and Circuits Leveraging Liquid Crystal Polymer and Ultra-Low Loss Dielectrics for High-Speed Digital and RFMW applicationsJim Rathburn
- Heterogeneous Integration of Magnetic Spin Wave and CMOS Chips into a Hybrid Computing SystemLars Böttcher
- Key Considerations for Enhancing the Partial Discharge Capability of High Voltage Power Semiconductor ModulesAshton PurcellJim Roemer
- Breaking Barriers in Semiconductor Packaging: Leveraging Glass-Based Substrates for Superior ConnectivitySung Jin Kim
- Performing Multiphysics Analysis During Heterogeneous IntegrationSean Palacio
- Arizona State University: A Leader in Advanced Packaging R&DJason Conrad
- Additive Manufacturing of Electronics at the Nano and Microscale for Making Trace, Interconnects, Passive and Active ComponentsAhmed Busnaina
- "Zero-Power" Additively Manufactured FHE-Enabled Wireless/5G+ Ultrabroadband Modules for IoT, Industry 4.0 and Smart Cities ApplicationsManos M. TentzerisMarvin Joshi
- Adhesive Properties for Successful Photonic PackagingGarian LimSee Chian limAlexander HartwigXin Tina GuoChongyang Liu
- Strategies to Prevent Gaseous Contaminants Issues in Sealed Electronic and Optoelectronic DevicesAlessio CorazzaLuca MauriGiovanni ZafaranaEnea Rizzi
- Self-Aligned Fiber-to-Waveguide Configuration for Enhanced Thermal Stability and Cost-Effective Production of Nanoporous Waveguides for SensingTanya HutterSerrita McAuleyWilliam WinterPaul Clarkson
- High Resolution Dry Film Photo-imageable Dielectric Enabling Dual-side Panel Level Fine Line RDLChristine B. HatterYaming JiangColin HayesMichael GallagherMark ReynoldsAndrew LotzKevin WangZhou (Joe) LuNeil LeuGregory ProkopowiczZhebin ZhangPatrick HuangChristopher GilmoreLiYen Lin
- Fluxless Reflow with “EA” TechnologyJeff Blair
- Thermo-Mechanical Reliability of Bi-Based Solders for High Temperature PackagingKyle WiegandFaharia H. BhuiyanHuilong LiuShubhra Bansal
- Material Property Simulation for Advanced PackagingYan LiSeo Young KimWoopoung KimMohammad Atif Faiz AfzalH. Shaun KwakDavid A. Nicholson
- Advanced Substrate Metallization in the Era of AI and HPCSam DharmarathnaSy Maddux
- Cu-Cu TCB – A Key Enabler for Ultra Fine-Pitch Heterogeneous ApplicationsBob ChylakSuleman AyubAdeel BajwaRyo SuganoTetsuya OgawaTom Colosimo
- Hybrid Bonding Based on Polyimide for Low Temperature ProcessHitoshi ArakiMasaya JukeiKota NomuraYugo TanigakiTakenori FujiwaraYu Shoji
- Electrochemical Plating of Metastable Fine Grain Cu for Cu-Cu Hybrid Bonding ApplicationsPingping YeThomas RichardsonJianwen HanAbdelhamid EISawyStephan Braye BrayeVeronica LambertHarshul KhannaAdam LetizeKyle WhittenElie Najjar
- Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid BondingJianwen HanPingping YeStephan BrayeAbdelhamid ElSawyHarshul KhannaVeronica LambertAdam LetizeKyle WhittenThomas RichardsonElie Najjar
- Characterization and Metrology Development of a Copper Plating Bath for Hybrid Bonding InterconnectMike PavlovArtyom DuevDanni LinEugene ShalytCynthia WangWilliam Schultz
- Trends and Infrastructure for AIE. Jan Vardaman
- Enabling High Aspect-Ratio Interconnects for Advanced Packaging of MEMS and SensorsMatt WeimerIrina StateikinaSara HarrisDane LindblandMarc GuilmainXavier Gaudreau-MironArrelaine Dameron
- New Package Solutions for Automotive Optical SensorsWeilung LuAdrian Arcedera
- Small Form Factor MEMS PackagesLawrence NatanAdrian Arcedera
- A Nanopackage for Silicon Nanowire-Based Sensor ApplicationsThambiraj SelvarathinamBruce Kim
- Novel Packaging Approach for Enhanced Performance Gas SensorLuca MaggiMarco Del SartoMichele DellutriGiuseppe BrunoLuigi Barretta
- LIME: Liquid Metal for SemiconductorsNick Baker
- Large Body Lidded FCBGA Thermal Performance Study with Indium-Silver Alloy TIMYoungDo KweonSangHyuk KimMinJae Kong
- Alternative to Solder TIM 1 Using Liquid Metal Reinforced with Z-axis Oriented Carbon FiberSteve StagonNikhil JaniRobert MoneChunzhou PanTao HuangEthan ColburnSeth Liyanage
- Highly Accelerated Stress Testing (HAST) of Liquid Metal based Thermal Interface MaterialsSwagata MondalKeyton FellerLoren RussellCara RossettiDylan ShahNavid Kazem
- Improved Thermal Management in EV Power Electronics with Boron Nitride Filled Potting CompoundsAnand MurugaiahIsmail NasBei Xiang
- Warpage Evaluation in Embedded Bridge Package for Advanced Package SolutionsWiwy WudjudRoger LoLihong CaoChin-Li KaoFY ChenYungshun ChangYiHsien Wu
- Novel Package Structure for Enhancing Power Integrity Performance & Cost EfficiencyMinWon ParkTaeYong Lee
- Metallization of High-Aspect Ratio Vias on Advanced IC-Substrates Using a Novel Liquid Metal InkSue KaoSiyang LiuHongbin YuSimon McElreaGibran Liezer EsquenaziSunity Sharma
- Study of 10micron Pitch Interconnect Bonding of Heterogeneous Materials for High Resolution SWIR ImagersBart VereeckeGauri KarveNaresh ChandrasekaranJaber DerakhshandehAurore LuuBarundeb DuttaAurélien Griffart
- 3D Heterogeneous Integrated RF Systems-in-Package using Glass PackagingJeb H. FlemmingRob HulsmanKyle McWethy
- Yield and Cost Analysis of a Face-to-Back Chip-on-Wafer 3D PackageAmy Lujan
- Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O ComponentsLars Böttcher
- The Roles of Emerging IC Substrates from a Signal Performance and Power Delivery PerspectiveGerald WeisStefano Sergio OggioniKarl KirchheimerPatrick Fleischhacker
- Through Glass Via (TGV) Etching on Glass Core Substrates for High Density 3D Advanced Packaging ApplicationsVenu GovindarajuluCoby TaoZia KarimVengal JalagamKeshav ChandranJeffrey Vu
- Fine-Pitch RDL with Excellent Signal Transmission Performance Formed on Glass for Heterogeneous IntegrationTakamasa Takano
- The Role of LIDE Technology in Enhanced Glass Micro-Processing for More than TGVRichard NoackNils AnspachRoman OstholtRafael SantosDaniel Dunker
- High-Throughput Fabrication of Glass Micro-Vias Through a Direct Laser Ablation Process Utilizing a DOE and an Optimized KrF Excimer LaserYasufumi KawasujiAkira SuwaMasanori TeramotoTomonari TanakaJun-Ro YoonRobert Schaut
- Automated Multi-Physics Reliability-Oriented Layout Design for Multi-Chip Power Modules Using the LAREL ToolDavid Agogo-MawuliGabriel OkaforWhit VinsonDavid HuitinkAlan Mantooth
- Firewalls in Semiconductor Assembly: Ensuring Quality & Reliability in Automotive ApplicationsPrasad Dhond
- Early Damage Detection in Power Electronics Using Thermal RC NetworksMichael ReimSven ReitzJens Warmuth
- Extending Board Level Reliability(BLR) of a Wafer Level Fanout 4D Digital Radar Chiplet PackageLinda BalTom Dolbear
- Panel Level Package: Reliability Evaluation of Double-sided Direct Copper Plated Interconnects on Embedded Power Die by Thermal and Electrical Stress TestKatsuhiro TakaoYuki MatsueKoji IwabuAtsushi KurohaMichihito KawadaIchiro KonoTakashi SuzukiYoshiaki Aizawa
- Advances in Vertical Wire Bonding for Through Mold Interconnect and Fan Out Wafer Level PackagesJohn FoleyDaniel Tan
- QFN Reimagined: Molded Fan-out Panel Solutions for Cost Efficiency and ScalabilityChevie CastilloRobin Davis
- M-Series Fan-out Interposer Technology (MFIT) with Vertical Interconnect BlocksRobin DavisBenedict San Jose
- Heterogenous Integration in High Volume: Now and Looking ForwardWilliam LambertDeepak KulkarniRaja Swaminathan
- Instrumented Getter using Additive ManufacturingRobert N. DeanMd Golam SarwarPradeep LallMichael PrevitiSeung Kim
- Complex Permittivity Measurements of Substrates and Thin Films at Millimeter-Wave FrequenciesLucas EnrightBryan BosworthNick JungwirthFlorian BergmannGeoff BrenneckaBenjamin JamrozNate Orloff
- Millimeter-Wave “Reflectionless” Filters and Diplexers Based on Silicon MicromachiningRobert WeikleNoah D. SauberMatthew BauwensMichael CybereyN.S. BarkerA.W. Lichtenberger
- Investigation of Behavior of Nanovoids in Electroless Cu Layer of 1st via Bottom of 3-Layer Stacked Micro-via Integrated in Substrate under Thermal Shock TestMasahiko NishijimaMing-Chun HsiehZheng ZhangRieko OkumuraHiroyoshi YoshidaChuantong ChenAiji SuetakeKimihiro YamanakaKatsuaki SuganumaHiroki SetoYuhei KitaharaKei Hashizume
- Reliability of SnAgCu Composite Solder Joints in a Corrosive EnvironmentBalázs IllésAdrian PietruszkaHalim ChoiPaweł GóreckiAgata Skwarek-Illés
- SAC305 Solder Electromigration KineticsPrabjit (PJ) Singh
- Advanced Packaging Innovations for AI and HPC Enhancing Performance with SiCN for Hybrid Bonding and SiN or SiON for Wafer Flatness OptimizationMohamed ElGhazzaliMarkus FreiRoland RettenmeierKenton ReadEwald StrolzRiccardo MorcianoPatrick Carazzetti
- AI Market Today and Beyond: Transforming the Future of Advanced PackagingGabriela Pereira
- Integrating Thin Film Resistors into Organic Substrates for Module and Integrated Circuit (IC)PackagingJohn AndresakisAndreas SchilloffMark Chasse
- S-Parameter Rational Function (SRF) Based Effective Power Delivery Analysis for 3D Foveros PackagesMohammad S IslamKinger CaiSophia AlvarezYou Zhang TanYihong YangVijay GovindarajanThim Khuen WongJulio Soto
- Saras eVRSTile-Enabling the Next Generation of AI & HPC Power Delivery Network DesignsBart DeProspo
- Power, Performance, and Packaging: The 3 P’s Driving Infrastructure & ProgressJB Baker
- AI Market Today and Beyond: Transforming the Future of Advanced PackagingGabriela Pereira
Natan, Lawrence, and Adrian Arcedera. 2025. “Small Form Factor MEMS Packages.” IMAPSource Proceedings 2025 (DPC): 677–707. https://doi.org/10.4071/001c.151780.