Reliability of SnAgCu Composite Solder Joints in a Corrosive Environment

Balázs Illés; Adrian Pietruszka; Halim Choi; Paweł Górecki; Agata Skwarek-Illés

doi:10.4071/001c.147798

Illés, Balázs, Adrian Pietruszka, Halim Choi, Paweł Górecki, and Agata Skwarek-Illés. 2025. “Reliability of SnAgCu Composite Solder Joints in a Corrosive Environment.” IMAPSource Proceedings 2025 (DPC): 1421–46. https://doi.org/10.4071/001c.147798.

View more stats