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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2025, Issue DPC, 2025December 08, 2025 EDT

Adhesive Properties for Successful Photonic Packaging

Garian Lim, See Chian lim, Alexander Hartwig, Xin Tina Guo, Chongyang Liu,
2.5D/3D advanced packagingsilicon photonics packagingphotonic integrated circuits (PICs)
https://doi.org/10.4071/001c.154003
IMAPSource Conference Papers
Lim, Garian, See Chian lim, Alexander Hartwig, Xin Tina Guo, and Chongyang Liu. 2025. “Adhesive Properties for Successful Photonic Packaging.” IMAPSource Proceedings 2025 (DPC): 1071–99. https:/​/​doi.org/​10.4071/​001c.154003.

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