ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 01, 2025 EDT
High-Throughput Fabrication of Glass Micro-Vias Through a Direct Laser Ablation Process Utilizing a DOE and an Optimized KrF Excimer Laser
High-Throughput Fabrication of Glass Micro-Vias Through a Direct Laser Ablation Process Utilizing a DOE and an Optimized KrF Excimer Laser
Kawasuji, Yasufumi, Akira Suwa, Masanori Teramoto, Tomonari Tanaka, Jun-Ro Yoon, and Robert Schaut. 2025. “High-Throughput Fabrication of Glass Micro-Vias Through a Direct Laser Ablation Process Utilizing a DOE and an Optimized KrF Excimer Laser.” IMAPSource Proceedings 2025 (DPC): 235–66. https://doi.org/10.4071/001c.151201.