ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 01, 2025 EDT
Yield and Cost Analysis of a Face-to-Back Chip-on-Wafer 3D Package
Yield and Cost Analysis of a Face-to-Back Chip-on-Wafer 3D Package
Lujan, Amy. 2025. “Yield and Cost Analysis of a Face-to-Back Chip-on-Wafer 3D Package.” IMAPSource Proceedings 2025 (DPC): 383–404. https://doi.org/10.4071/001c.151709.