ISSN 2380-4505
Vol. 2025, Issue DPC, 2025November 19, 2025 EDT
Breaking Barriers in Semiconductor Packaging: Leveraging Glass-Based Substrates for Superior Connectivity
Breaking Barriers in Semiconductor Packaging: Leveraging Glass-Based Substrates for Superior Connectivity
Kim, Sung Jin. 2025. “Breaking Barriers in Semiconductor Packaging: Leveraging Glass-Based Substrates for Superior Connectivity.” IMAPSource Proceedings 2025 (DPC): 1–18. https://doi.org/10.4071/001c.147809.