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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2025, Issue DPC, 2025November 25, 2025 EDT

Automated Multi-Physics Reliability-Oriented Layout Design for Multi-Chip Power Modules Using the LAREL Tool

David Agogo-Mawuli, Gabriel Okafor, Whit Vinson, David Huitink, Alan Mantooth,
multi-chip power modules (MCPMs)power electronics applications
https://doi.org/10.4071/001c.151199
IMAPSource Conference Papers
Agogo-Mawuli, David, Gabriel Okafor, Whit Vinson, David Huitink, and Alan Mantooth. 2025. “Automated Multi-Physics Reliability-Oriented Layout Design for Multi-Chip Power Modules Using the LAREL Tool.” IMAPSource Proceedings 2025 (DPC): 219–34. https:/​/​doi.org/​10.4071/​001c.151199.

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