ISSN 2380-4505
Li, Yan, Seo Young Kim, Woopoung Kim, Mohammad Atif Faiz Afzal, H. Shaun Kwak, and David A. Nicholson. 2025. “Material Property Simulation for Advanced Packaging.” IMAPSource Proceedings 2025 (DPC): 932–46. https://doi.org/10.4071/001c.153880.