ISSN 2380-4505
Vol. 2025, Issue DPC, 2025November 19, 2025 EDT
Performing Multiphysics Analysis During Heterogeneous Integration
Performing Multiphysics Analysis During Heterogeneous Integration
Articles in Vol. 2025, Issue DPC, 2025
Vol. 2025, Issue DPC, 2025
- Advanced High-Density Substrates and Circuits Leveraging Liquid Crystal Polymer and Ultra-Low Loss Dielectrics for High-Speed Digital and RFMW applicationsJim Rathburn
- Heterogeneous Integration of Magnetic Spin Wave and CMOS Chips into a Hybrid Computing SystemLars Böttcher
- Key Considerations for Enhancing the Partial Discharge Capability of High Voltage Power Semiconductor ModulesAshton PurcellJim Roemer
- Breaking Barriers in Semiconductor Packaging: Leveraging Glass-Based Substrates for Superior ConnectivitySung Jin Kim
- Performing Multiphysics Analysis During Heterogeneous IntegrationSean Palacio
- Arizona State University: A Leader in Advanced Packaging R&DJason Conrad
- Additive Manufacturing of Electronics at the Nano and Microscale for Making Trace, Interconnects, Passive and Active ComponentsAhmed Busnaina
- "Zero-Power" Additively Manufactured FHE-Enabled Wireless/5G+ Ultrabroadband Modules for IoT, Industry 4.0 and Smart Cities ApplicationsManos M. TentzerisMarvin Joshi
- Adhesive Properties for Successful Photonic PackagingGarian LimSee Chian limAlexander HartwigXin Tina GuoChongyang Liu
- Strategies to Prevent Gaseous Contaminants Issues in Sealed Electronic and Optoelectronic DevicesAlessio CorazzaLuca MauriGiovanni ZafaranaEnea Rizzi
- Self-Aligned Fiber-to-Waveguide Configuration for Enhanced Thermal Stability and Cost-Effective Production of Nanoporous Waveguides for SensingTanya HutterSerrita McAuleyWilliam WinterPaul Clarkson
- High Resolution Dry Film Photo-imageable Dielectric Enabling Dual-side Panel Level Fine Line RDLChristine B. HatterYaming JiangColin HayesMichael GallagherMark ReynoldsAndrew LotzKevin WangZhou (Joe) LuNeil LeuGregory ProkopowiczZhebin ZhangPatrick HuangChristopher GilmoreLiYen Lin
- Fluxless Reflow with “EA” TechnologyJeff Blair
- Thermo-Mechanical Reliability of Bi-Based Solders for High Temperature PackagingKyle WiegandFaharia H. BhuiyanHuilong LiuShubhra Bansal
- Material Property Simulation for Advanced PackagingYan LiSeo Young KimWoopoung KimMohammad Atif Faiz AfzalH. Shaun KwakDavid A. Nicholson
- Advanced Substrate Metallization in the Era of AI and HPCSam DharmarathnaSy Maddux
- Cu-Cu TCB – A Key Enabler for Ultra Fine-Pitch Heterogeneous ApplicationsBob ChylakSuleman AyubAdeel BajwaRyo SuganoTetsuya OgawaTom Colosimo
- Hybrid Bonding Based on Polyimide for Low Temperature ProcessHitoshi ArakiMasaya JukeiKota NomuraYugo TanigakiTakenori FujiwaraYu Shoji
- Electrochemical Plating of Metastable Fine Grain Cu for Cu-Cu Hybrid Bonding ApplicationsPingping YeThomas RichardsonJianwen HanAbdelhamid EISawyStephan Braye BrayeVeronica LambertHarshul KhannaAdam LetizeKyle WhittenElie Najjar
- Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid BondingJianwen HanPingping YeStephan BrayeAbdelhamid ElSawyHarshul KhannaVeronica LambertAdam LetizeKyle WhittenThomas RichardsonElie Najjar
- Characterization and Metrology Development of a Copper Plating Bath for Hybrid Bonding InterconnectMike PavlovArtyom DuevDanni LinEugene ShalytCynthia WangWilliam Schultz
- Trends and Infrastructure for AIE. Jan Vardaman
- Enabling High Aspect-Ratio Interconnects for Advanced Packaging of MEMS and SensorsMatt WeimerIrina StateikinaSara HarrisDane LindblandMarc GuilmainXavier Gaudreau-MironArrelaine Dameron
- New Package Solutions for Automotive Optical SensorsWeilung LuAdrian Arcedera
- Small Form Factor MEMS PackagesLawrence NatanAdrian Arcedera
- A Nanopackage for Silicon Nanowire-Based Sensor ApplicationsThambiraj SelvarathinamBruce Kim
- Novel Packaging Approach for Enhanced Performance Gas SensorLuca MaggiMarco Del SartoMichele DellutriGiuseppe BrunoLuigi Barretta
- LIME: Liquid Metal for SemiconductorsNick Baker
- Large Body Lidded FCBGA Thermal Performance Study with Indium-Silver Alloy TIMYoungDo KweonSangHyuk KimMinJae Kong
- Alternative to Solder TIM 1 Using Liquid Metal Reinforced with Z-axis Oriented Carbon FiberSteve StagonNikhil JaniRobert MoneChunzhou PanTao HuangEthan ColburnSeth Liyanage
- Highly Accelerated Stress Testing (HAST) of Liquid Metal based Thermal Interface MaterialsSwagata MondalKeyton FellerLoren RussellCara RossettiDylan ShahNavid Kazem
- Improved Thermal Management in EV Power Electronics with Boron Nitride Filled Potting CompoundsAnand MurugaiahIsmail NasBei Xiang
- Warpage Evaluation in Embedded Bridge Package for Advanced Package SolutionsWiwy WudjudRoger LoLihong CaoChin-Li KaoFY ChenYungshun ChangYiHsien Wu
- Novel Package Structure for Enhancing Power Integrity Performance & Cost EfficiencyMinWon ParkTaeYong Lee
- Metallization of High-Aspect Ratio Vias on Advanced IC-Substrates Using a Novel Liquid Metal InkSue KaoSiyang LiuHongbin YuSimon McElreaGibran Liezer EsquenaziSunity Sharma
- Study of 10micron Pitch Interconnect Bonding of Heterogeneous Materials for High Resolution SWIR ImagersBart VereeckeGauri KarveNaresh ChandrasekaranJaber DerakhshandehAurore LuuBarundeb DuttaAurélien Griffart
- 3D Heterogeneous Integrated RF Systems-in-Package using Glass PackagingJeb H. FlemmingRob HulsmanKyle McWethy
- Yield and Cost Analysis of a Face-to-Back Chip-on-Wafer 3D PackageAmy Lujan
- Development of a High-Density Adaptive Redistribution Technology for Embedded High I/O ComponentsLars Böttcher
- The Roles of Emerging IC Substrates from a Signal Performance and Power Delivery PerspectiveGerald WeisStefano Sergio OggioniKarl KirchheimerPatrick Fleischhacker
- Through Glass Via (TGV) Etching on Glass Core Substrates for High Density 3D Advanced Packaging ApplicationsVenu GovindarajuluCoby TaoZia KarimVengal JalagamKeshav ChandranJeffrey Vu
- Fine-Pitch RDL with Excellent Signal Transmission Performance Formed on Glass for Heterogeneous IntegrationTakamasa Takano
- The Role of LIDE Technology in Enhanced Glass Micro-Processing for More than TGVRichard NoackNils AnspachRoman OstholtRafael SantosDaniel Dunker
- High-Throughput Fabrication of Glass Micro-Vias Through a Direct Laser Ablation Process Utilizing a DOE and an Optimized KrF Excimer LaserYasufumi KawasujiAkira SuwaMasanori TeramotoTomonari TanakaJun-Ro YoonRobert Schaut
- Automated Multi-Physics Reliability-Oriented Layout Design for Multi-Chip Power Modules Using the LAREL ToolDavid Agogo-MawuliGabriel OkaforWhit VinsonDavid HuitinkAlan Mantooth
- Firewalls in Semiconductor Assembly: Ensuring Quality & Reliability in Automotive ApplicationsPrasad Dhond
- Early Damage Detection in Power Electronics Using Thermal RC NetworksMichael ReimSven ReitzJens Warmuth
- Extending Board Level Reliability(BLR) of a Wafer Level Fanout 4D Digital Radar Chiplet PackageLinda BalTom Dolbear
- Panel Level Package: Reliability Evaluation of Double-sided Direct Copper Plated Interconnects on Embedded Power Die by Thermal and Electrical Stress TestKatsuhiro TakaoYuki MatsueKoji IwabuAtsushi KurohaMichihito KawadaIchiro KonoTakashi SuzukiYoshiaki Aizawa
- Advances in Vertical Wire Bonding for Through Mold Interconnect and Fan Out Wafer Level PackagesJohn FoleyDaniel Tan
- QFN Reimagined: Molded Fan-out Panel Solutions for Cost Efficiency and ScalabilityChevie CastilloRobin Davis
- M-Series Fan-out Interposer Technology (MFIT) with Vertical Interconnect BlocksRobin DavisBenedict San Jose
- Heterogenous Integration in High Volume: Now and Looking ForwardWilliam LambertDeepak KulkarniRaja Swaminathan
- Instrumented Getter using Additive ManufacturingRobert N. DeanMd Golam SarwarPradeep LallMichael PrevitiSeung Kim
- Complex Permittivity Measurements of Substrates and Thin Films at Millimeter-Wave FrequenciesLucas EnrightBryan BosworthNick JungwirthFlorian BergmannGeoff BrenneckaBenjamin JamrozNate Orloff
- Millimeter-Wave “Reflectionless” Filters and Diplexers Based on Silicon MicromachiningRobert WeikleNoah D. SauberMatthew BauwensMichael CybereyN.S. BarkerA.W. Lichtenberger
- Investigation of Behavior of Nanovoids in Electroless Cu Layer of 1st via Bottom of 3-Layer Stacked Micro-via Integrated in Substrate under Thermal Shock TestMasahiko NishijimaMing-Chun HsiehZheng ZhangRieko OkumuraHiroyoshi YoshidaChuantong ChenAiji SuetakeKimihiro YamanakaKatsuaki SuganumaHiroki SetoYuhei KitaharaKei Hashizume
- Reliability of SnAgCu Composite Solder Joints in a Corrosive EnvironmentBalázs IllésAdrian PietruszkaHalim ChoiPaweł GóreckiAgata Skwarek-Illés
- SAC305 Solder Electromigration KineticsPrabjit (PJ) Singh
- Advanced Packaging Innovations for AI and HPC Enhancing Performance with SiCN for Hybrid Bonding and SiN or SiON for Wafer Flatness OptimizationMohamed ElGhazzaliMarkus FreiRoland RettenmeierKenton ReadEwald StrolzRiccardo MorcianoPatrick Carazzetti
- AI Market Today and Beyond: Transforming the Future of Advanced PackagingGabriela Pereira
- Integrating Thin Film Resistors into Organic Substrates for Module and Integrated Circuit (IC)PackagingJohn AndresakisAndreas SchilloffMark Chasse
- S-Parameter Rational Function (SRF) Based Effective Power Delivery Analysis for 3D Foveros PackagesMohammad S IslamKinger CaiSophia AlvarezYou Zhang TanYihong YangVijay GovindarajanThim Khuen WongJulio Soto
- Saras eVRSTile-Enabling the Next Generation of AI & HPC Power Delivery Network DesignsBart DeProspo
- Power, Performance, and Packaging: The 3 P’s Driving Infrastructure & ProgressJB Baker
- AI Market Today and Beyond: Transforming the Future of Advanced PackagingGabriela Pereira
Palacio, Sean. 2025. “Performing Multiphysics Analysis During Heterogeneous Integration.” IMAPSource Proceedings 2025 (DPC): 1286–98. https://doi.org/10.4071/001c.147780.