ISSN 2380-4505
Vol. 2025, Issue DPC, 2025November 19, 2025 EDT
Integrating Thin Film Resistors into Organic Substrates for Module and Integrated Circuit (IC)Packaging
Integrating Thin Film Resistors into Organic Substrates for Module and Integrated Circuit (IC)Packaging
Andresakis, John, Andreas Schilloff, and Mark Chasse. 2025. “Integrating Thin Film Resistors into Organic Substrates for Module and Integrated Circuit (IC)Packaging.” IMAPSource Proceedings 2025 (DPC): 1342–57. https://doi.org/10.4071/001c.147786.