ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 05, 2025 EDT
Hybrid Bonding Based on Polyimide for Low Temperature Process
Hybrid Bonding Based on Polyimide for Low Temperature Process
Araki, Hitoshi, Masaya Jukei, Kota Nomura, Yugo Tanigaki, Takenori Fujiwara, and Yu Shoji. 2025. “Hybrid Bonding Based on Polyimide for Low Temperature Process.” IMAPSource Proceedings 2025 (DPC): 859–88. https://doi.org/10.4071/001c.153872.
