ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 05, 2025 EDT
Characterization and Metrology Development of a Copper Plating Bath for Hybrid Bonding Interconnect
Characterization and Metrology Development of a Copper Plating Bath for Hybrid Bonding Interconnect
Pavlov, Mike, Artyom Duev, Danni Lin, Eugene Shalyt, Cynthia Wang, and William Schultz. 2025. “Characterization and Metrology Development of a Copper Plating Bath for Hybrid Bonding Interconnect.” IMAPSource Proceedings 2025 (DPC): 797–823. https://doi.org/10.4071/001c.153868.