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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2025, Issue DPC, 2025December 01, 2025 EDT

The Role of LIDE Technology in Enhanced Glass Micro-Processing for More than TGV

Richard Noack, Nils Anspach, Roman Ostholt, Rafael Santos, Daniel Dunker,
advanced packagingheterogeneous integrationglass substrates
https://doi.org/10.4071/001c.151700
IMAPSource Conference Papers
Noack, Richard, Nils Anspach, Roman Ostholt, Rafael Santos, and Daniel Dunker. 2025. “The Role of LIDE Technology in Enhanced Glass Micro-Processing for More than TGV.” IMAPSource Proceedings 2025 (DPC): 267–94. https:/​/​doi.org/​10.4071/​001c.151700.

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