Electrochemical Plating of Metastable Fine Grain Cu for Cu-Cu Hybrid Bonding Applications

Pingping Ye; Thomas Richardson; Jianwen Han; Abdelhamid EISawy; Stephan Braye Braye; Veronica Lambert; Harshul Khanna; Adam Letize; Kyle Whitten; Elie Najjar

doi:10.4071/001c.153870

Ye, Pingping, Thomas Richardson, Jianwen Han, Abdelhamid EISawy, Stephan Braye Braye, Veronica Lambert, Harshul Khanna, Adam Letize, Kyle Whitten, and Elie Najjar. 2025. “Electrochemical Plating of Metastable Fine Grain Cu for Cu-Cu Hybrid Bonding Applications.” IMAPSource Proceedings 2025 (DPC): 842–58. https://doi.org/10.4071/001c.153870.

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