ISSN 2380-4505
Vol. 2025, Issue DPC, 2025December 05, 2025 EDT
Thermo-Mechanical Reliability of Bi-Based Solders for High Temperature Packaging
Thermo-Mechanical Reliability of Bi-Based Solders for High Temperature Packaging
Wiegand, Kyle, Faharia H. Bhuiyan, Huilong Liu, and Shubhra Bansal. 2025. “Thermo-Mechanical Reliability of Bi-Based Solders for High Temperature Packaging.” IMAPSource Proceedings 2025 (DPC): 947–75. https://doi.org/10.4071/001c.153881.