This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:47830/feed
ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2025, Issue DPC, 2025December 05, 2025 EDT

High Resolution Dry Film Photo-imageable Dielectric Enabling Dual-side Panel Level Fine Line RDL

Christine B. Hatter, Yaming Jiang, Colin Hayes, Michael Gallagher, Mark Reynolds, Andrew Lotz, Kevin Wang, Zhou (Joe) Lu, Neil Leu, Gregory Prokopowicz, Zhebin Zhang, Patrick Huang, Christopher Gilmore, LiYen Lin,
advanced substratesfine line RDL2.5D/3D packaging
https://doi.org/10.4071/001c.153883
IMAPSource Conference Papers
Hatter, Christine B., Yaming Jiang, Colin Hayes, Michael Gallagher, Mark Reynolds, Andrew Lotz, Kevin Wang, et al. 2025. “High Resolution Dry Film Photo-Imageable Dielectric Enabling Dual-Side Panel Level Fine Line RDL.” IMAPSource Proceedings 2025 (DPC): 990–1018. https:/​/​doi.org/​10.4071/​001c.153883.

View more stats

Powered by Scholastica, the modern academic journal management system