ISSN 2380-4505
Vol. 2025, Issue DPC, 2025November 19, 2025 EDT
Investigation of Behavior of Nanovoids in Electroless Cu Layer of 1st via Bottom of 3-Layer Stacked Micro-via Integrated in Substrate under Thermal Shock Test
Investigation of Behavior of Nanovoids in Electroless Cu Layer of 1st via Bottom of 3-Layer Stacked Micro-via Integrated in Substrate under Thermal Shock Test
Nishijima, Masahiko, Ming-Chun Hsieh, Zheng Zhang, Rieko Okumura, Hiroyoshi Yoshida, Chuantong Chen, Aiji Suetake, et al. 2025. “Investigation of Behavior of Nanovoids in Electroless Cu Layer of 1st via Bottom of 3-Layer Stacked Micro-via Integrated in Substrate under Thermal Shock Test.” IMAPSource Proceedings 2025 (DPC): 1447–70. https://doi.org/10.4071/001c.147799.