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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2025, Issue DPC, 2025December 02, 2025 EDT

Alternative to Solder TIM 1 Using Liquid Metal Reinforced with Z-axis Oriented Carbon Fiber

Steve Stagon, Nikhil Jani, Robert Mone, Chunzhou Pan, Tao Huang, Ethan Colburn, Seth Liyanage,
TIM1 technologythermal managementgallium-based liquid metal alloy
https://doi.org/10.4071/001c.151773
IMAPSource Conference Papers
Stagon, Steve, Nikhil Jani, Robert Mone, Chunzhou Pan, Tao Huang, Ethan Colburn, and Seth Liyanage. 2025. “Alternative to Solder TIM 1 Using Liquid Metal Reinforced with Z-Axis Oriented Carbon Fiber.” IMAPSource Proceedings 2025 (DPC): 577–91. https:/​/​doi.org/​10.4071/​001c.151773.

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